參數(shù)資料
型號(hào): MCP2200T-I/SO
廠商: Microchip Technology
文件頁(yè)數(shù): 8/34頁(yè)
文件大?。?/td> 0K
描述: IC USB 2.0 - UART 20SOIC
標(biāo)準(zhǔn)包裝: 1,600
特點(diǎn): USB 至 UART
通道數(shù): 8
FIFO's: 256 字節(jié)
規(guī)程: USB 2.0
電源電壓: 3 V ~ 5.5 V
帶自動(dòng)流量控制功能:
安裝類(lèi)型: 表面貼裝
封裝/外殼: 20-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 20-SOIC
包裝: 帶卷 (TR)
MCP2003/4/3A/4A
DS22230D-page 16
2010-2011 Microchip Technology Inc.
2.5
Thermal Specifications
THERMAL CHARACTERISTICS
Parameter
Symbol
Typ
Max
Units
Test Conditions
Recovery Temperature
θRECOVERY
+140
°C
Shutdown Temperature
θSHUTDOWN
+150
°C
Short Circuit Recovery Time
tTHERM
1.5
5.0
ms
Thermal Package Resistances
Thermal Resistance, 8L-DFN
θJA
35.7
°C/W
Thermal Resistance, 8L-PDIP
θJA
89.3
°C/W
Thermal Resistance, 8L-SOIC
θJA
149.5
°C/W
Note 1:
The maximum power dissipation is a function of TJMAX,
ΘJA and ambient temperature T
A. The maximum
allowable power dissipation at an ambient temperature is PD = (TJMAX - TA)
ΘJA. If this dissipation is
exceeded, the die temperature will rise above 150
°C and the device will go into thermal shutdown.
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