參數(shù)資料
型號: MCP201-E/SN
廠商: Microchip Technology
文件頁數(shù): 26/40頁
文件大小: 0K
描述: IC LIN TXRX ON-BOARD VREG 8SOIC
產(chǎn)品培訓(xùn)模塊: Microchip MCP20xx LIN Transceiver Overview
標(biāo)準(zhǔn)包裝: 100
類型: 線路收發(fā)器
驅(qū)動器/接收器數(shù): 1/1
規(guī)程: LIN
電源電壓: 6 V ~ 18 V
安裝類型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 8-SOICN
包裝: 管件
MCP201
DS21730F-page 32
2007 Microchip Technology Inc.
8-Lead Plastic Dual Flat, No Lead Package (MF) – 6x5 mm Body [DFN-S]
PUNCH SINGULATED
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
8
Pitch
e
1.27 BSC
Overall Height
A
0.85
1.00
Molded Package Thickness
A2
0.65
0.80
Standoff
A1
0.00
0.01
0.05
Base Thickness
A3
0.20 REF
Overall Length
D
4.92 BSC
Molded Package Length
D1
4.67 BSC
Exposed Pad Length
D2
3.85
4.00
4.15
Overall Width
E
5.99 BSC
Molded Package Width
E1
5.74 BSC
Exposed Pad Width
E2
2.16
2.31
2.46
Contact Width
b
0.35
0.40
0.47
Contact Length
L
0.50
0.60
0.75
Contact-to-Exposed Pad
K
0.20
Model Draft Angle Top
φ
12°
φ
NOTE 2
A3
A2
A1
A
NOTE 1
EXPOSED
PAD
BOTTOM VIEW
1
2
D2
2
1
E2
K
L
N
e
b
E
E1
D
D1
N
TOP VIEW
Microchip Technology Drawing C04-113B
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