參數(shù)資料
型號: MCIMX253DJM4A
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 400 MHz, MICROPROCESSOR, PBGA400
封裝: 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-400
文件頁數(shù): 16/154頁
文件大?。?/td> 1498K
代理商: MCIMX253DJM4A
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 8
112
Freescale Semiconductor
3.7.18.2
ADC Timing Diagrams
Figure 82 represents the synchronization between the signals clk, soc, eoc, and the output bits in the usage
of the internal ADC. After a conversion cycle eoc is asserted, a new conversion begins only when the
Power Supply Requirements
Current consumption2
NVCC_ADC
QVDD
——
2.1
0.5
mA
Power-down current
NVCC_ADC
QVDD
——
1
10
uA
Touchscreen Interface
Expected plate resistance
100
1500
Ω
Switch drivers on
resistance
GND and VDD switches
10
Ω
Conversion Characteristics3
DNL4
fin = 1 kHz
+/–0.75
LSB
INL4
fin = 1 kHz
+/–2.0
LSB
Gain + Offset Error
+/–2
%FS
1 This comprises only the required initial dummy conversion cycle. Additional power-up time depends on the enadc, reset and
soc
signals applied to the touchscreen controller.
2 This value only includes the ADC and the driver switches, but it does not take into account the current consumption in the
touchscreen plate. For example, if the plate resistance is 100 W, the total current consumption is about 33 mA.
3 At avdd = 3.3 V, dvdd = 1.2 V, Tjunction = 50 °C, fclk = 1.75 MHz, any process corner, unless otherwise noted.
4 Value measured with a –0.5 dBFS sinusoidal input signal and computed with the code density test.
Table 85. Touchscreen ADC Electrical Specifications (continued)
Parameter
Conditions
Min.
Typ.
Max.
Unit
相關(guān)PDF資料
PDF描述
MCIMX257CJN4A 32-BIT, 400 MHz, MICROPROCESSOR, PBGA347
MCIMX253CJM4A 32-BIT, 400 MHz, MICROPROCESSOR, PBGA400
MCIMX258CVM4 32-BIT, 400 MHz, MICROPROCESSOR, PBGA400
MD80C154-36/883D 8-BIT, 36 MHz, MICROCONTROLLER, CDIP40
MQ80C52TXXX-16P883D 8-BIT, MROM, 16 MHz, MICROCONTROLLER, CQFP44
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MCIMX253DVM4 功能描述:IC MPU I.MX25 COMM 400MAPBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:i.MX25 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:260 系列:73S12xx 核心處理器:80515 芯體尺寸:8-位 速度:24MHz 連通性:I²C,智能卡,UART/USART,USB 外圍設(shè)備:LED,POR,WDT 輸入/輸出數(shù):9 程序存儲器容量:64KB(64K x 8) 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:2K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:- 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:68-VFQFN 裸露焊盤 包裝:管件
MCIMX255AJM4 功能描述:處理器 - 專門應(yīng)用 IMX25 AUTOMOTIVE RoHS:否 制造商:Freescale Semiconductor 類型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432
MCIMX255AJM4A 功能描述:處理器 - 專門應(yīng)用 IMX25 1.2 AUTO RoHS:否 制造商:Freescale Semiconductor 類型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432
MCIMX255AJM4AR2 功能描述:處理器 - 專門應(yīng)用 IMX25 1.2 AUTO RoHS:否 制造商:Freescale Semiconductor 類型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432
MCIMX255AVM4 功能描述:處理器 - 專門應(yīng)用 SENNA IMX25 1.1 AUTO RoHS:否 制造商:Freescale Semiconductor 類型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432