參數(shù)資料
型號: MCIMX251AJM4A
廠商: Freescale Semiconductor
文件頁數(shù): 52/140頁
文件大?。?/td> 0K
描述: IC MPU I.MX25 AUTO 400MAPBGA
標(biāo)準(zhǔn)包裝: 90
系列: i.MX25
核心處理器: ARM9
芯體尺寸: 32-位
速度: 400MHz
連通性: 1 線,CAN,EBI/EMI,以太網(wǎng),I²C,MMC,智能卡,SPI,SSI,UART/USART,USB OTG
外圍設(shè)備: DMA,I²S,POR,PWM,WDT
輸入/輸出數(shù): 128
程序存儲(chǔ)器類型: 外部程序存儲(chǔ)器
RAM 容量: 144K x 8
電壓 - 電源 (Vcc/Vdd): 1.15 V ~ 1.52 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 3x12b
振蕩器型: 外部
工作溫度: -40°C ~ 85°C
封裝/外殼: 400-LFBGA
包裝: 托盤
i.MX25 Applications Processor for Automotive Products, Rev. 10
Freescale Semiconductor
19
current measurements are taken with customer-specific use-cases to reflect the normal operating
conditions in the end system.
The method for obtaining the maximum current is as follows:
1. Measure the worst case power consumption on individual rails using directed test on i.MX25.
2. Correlate the worst case power consumption power measurements with the worst case power
consumption simulations.
3. Combine common voltage rails based on the power supply sequencing requirements (add the
worst case power consumption on each rail within some test cases from several test cases run, to
maximize different rails in the power group).
4. Guard the worst case numbers for temperature and process variation.
5. The sum of individual rails is greater than the real world power consumption, since a real system
does not typically maximize the power consumption on all peripherals simultaneously.
6. BATT_VDD current is measured when the system is in reduced power mode maintaining the
RTC. When the system is in run mode, QVDD is used to supply the DryIce, so this current
becomes negligible. See Table 12, for more details on the power modes.
NOTE
The values mentioned above should not be taken as a typical max run data
for specific use cases. These values are Absolute MAX data. Freescale
recommends that the system current measurements are taken with
customer-specific use-cases to reflect normal operating conditions in the
end system.
Table 15. Power Consumption
Power Supply
Voltage (V)
Max Current (mA)
QVDD
1.52
360
NVCC_EMI1, NVCC_EMI2
1.9
30
NVCC_CRM, NVCC_SDIO, NVCC_CSI,
NVCC_NFC, NVCC_JTAG, NVCC_LCDC,
NVCC_MISC
3.6
110
MPLL_VDD, UPLL_VDD
1.65
20
USBPHY1_VDDA_BIAS, USBPHY1_UPLL_VDD,
USBPHY1_VDDA, USBPHY2_VDD,
OSC24M_VDD, NVCC_ADC
3.3
40
FUSE_VDD1
1 The FUSE_VDD rail is connected to ground. it only needs a voltage if the system fuse burning is needed.
3.6
62
BATT_VDD
1.55
0.030
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MCIMX251AJM4AR2 功能描述:處理器 - 專門應(yīng)用 IMX25 1.2 AUTO RoHS:否 制造商:Freescale Semiconductor 類型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432
MCIMX251AVM4 功能描述:處理器 - 專門應(yīng)用 SENNA IMX25 1.1 AUTO RoHS:否 制造商:Freescale Semiconductor 類型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432
MCIMX253CJM4 功能描述:處理器 - 專門應(yīng)用 IMX25 INDUSTRIAL RoHS:否 制造商:Freescale Semiconductor 類型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432
MCIMX253CJM4A 功能描述:處理器 - 專門應(yīng)用 IMX25 1.2 INDUST RoHS:否 制造商:Freescale Semiconductor 類型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432
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