參數(shù)資料
型號(hào): MCF5275CVM166
廠商: Freescale Semiconductor
文件頁(yè)數(shù): 2/44頁(yè)
文件大?。?/td> 0K
描述: IC MCU 32BIT 166MHZ 256-MAPBGA
標(biāo)準(zhǔn)包裝: 90
系列: MCF527x
核心處理器: Coldfire V2
芯體尺寸: 32-位
速度: 166MHz
連通性: EBI/EMI,以太網(wǎng),I²C,SPI,UART/USART,USB
外圍設(shè)備: DMA,WDT
輸入/輸出數(shù): 69
程序存儲(chǔ)器類(lèi)型: ROMless
RAM 容量: 64K x 8
電壓 - 電源 (Vcc/Vdd): 1.4 V ~ 1.6 V
振蕩器型: 外部
工作溫度: -40°C ~ 85°C
封裝/外殼: 256-LBGA
包裝: 散裝
MCF5275 Integrated Microprocessor Family Hardware Specification, Rev. 4
Design Recommendations
Freescale Semiconductor
10
5.2.1
Supply Voltage Sequencing and Separation Cautions
Figure 2 shows situations in sequencing the I/O VDD (OVDD), SDRAM VDD (SDVDD), PLL VDD
(PLLVDD), and Core VDD (VDD).
Figure 2. Supply Voltage Sequencing and Separation Cautions
The relationship between SDVDD and OVDD is non-critical during power-up and power-down sequences.
SDVDD (2.5V or 3.3V) and OVDD are specified relative to VDD.
5.2.1.1
Power Up Sequence
If OVDD/SDVDD are powered up with VDD at 0 V, then the sense circuits in the I/O pads cause all pad
output drivers connected to the OVDD/SDVDD to be in a high impedance state. There is no limit on how
long after OVDD/SDVDD powers up before VDD must powered up. VDD should not lead the OVDD,
SDVDD, or PLLVDD by more than 0.4 V during power ramp-up or high current will be in the internal ESD
protection diodes. The rise times on the power supplies should be slower than 1
μs to avoid turning on the
internal ESD protection clamp diodes.
The recommended power up sequence is as follows:
1. Use 1
μs or slower rise time for all supplies.
2. VDD/PLLVDD and OVDD/SDVDD should track up to 0.9 V, then separate for the completion of
ramps with OVDD/SD VDD going to the higher external voltages. One way to accomplish this is to
use a low drop-out voltage regulator.
SDVDD (2.5V)
Supplies Stable
2
1
3.3V
2.5V
1.5V
0
Time
Notes:
VDD should not exceed OVDD, SDVDD or PLLVDD by more than
0.4 V at any time, including power-up.
Recommended that VDD should track OVDD/SDVDD/PLLVDD up to
0.9 V, then separate for completion of ramps.
Input voltage must not be greater than the supply voltage (OVDD, SDVDD,
VDD, or PLLVDD) by more than 0.5 V at any time, including during power-up.
Use 1 ms or slower rise time for all supplies.
1.
2.
3.
4.
DC
P
o
w
e
rSupp
ly
V
o
ltage
VDD,
OVDD, SDVDD, PLLVDD
相關(guān)PDF資料
PDF描述
MCF53016CMJ240J IC MCU 32BIT 128KB 256MAPBGA
MCF5307FT90B IC MPU 32BIT COLDF 90MHZ 208FQFP
MCF5329CVM240 IC MCU 32BIT 240MHZ 256-MAPBGA
MCF5372LCVM240 IC MPU RISC 240MHZ 196-MAPBGA
MCF5407CAI220 IC MPU 32B 220MHZ COLDF 208-FQFP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MCF5275CVM166 制造商:Freescale Semiconductor 功能描述:Microprocessor IC
MCF5275CVM166J 功能描述:32位微控制器 - MCU V2CORE 64KSRAM RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲(chǔ)器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT
MCF5275LCVM133 功能描述:IC MCU 32BIT 133MHZ 196-MAPBGA RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:MCF527x 標(biāo)準(zhǔn)包裝:250 系列:56F8xxx 核心處理器:56800E 芯體尺寸:16-位 速度:60MHz 連通性:CAN,SCI,SPI 外圍設(shè)備:POR,PWM,溫度傳感器,WDT 輸入/輸出數(shù):21 程序存儲(chǔ)器容量:40KB(20K x 16) 程序存儲(chǔ)器類(lèi)型:閃存 EEPROM 大小:- RAM 容量:6K x 16 電壓 - 電源 (Vcc/Vdd):2.25 V ~ 3.6 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 6x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 125°C 封裝/外殼:48-LQFP 包裝:托盤(pán) 配用:MC56F8323EVME-ND - BOARD EVALUATION MC56F8323
MCF5275LCVM166 功能描述:微處理器 - MPU MCF5275L V2CORE 64KSRAM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MCF5275LCVM166J 功能描述:32位微控制器 - MCU V2CORE 64KSRAM RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲(chǔ)器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT