參數資料
型號: MC9S12DG256
廠商: Motorola, Inc.
英文描述: MC9S12DT256 Device User Guide V03.03
中文描述: MC9S12DT256設備的用戶手冊V03.03
文件頁數: 69/124頁
文件大?。?/td> 2125K
代理商: MC9S12DG256
69
Section 4 Modes of Operation
4.1 Overview
Eight possible modes determine the operating configuration of the MC9S12DP512. Each mode has an
associated default memory map and external bus configuration controlled by a further pin.
Three low power modes exist for the device (
Section 4.4 Low Power Modes
).
4.2 Chip Configuration Summary
TheoperatingmodeoutofresetisdeterminedbythestatesoftheMODC,MODB,andMODApinsduring
reset(
Table 4-1
).TheMODC,MODB,andMODAbitsintheMODEregistershowthecurrentoperating
modeandprovidelimitedmodeswitchingduringoperation.ThestatesoftheMODC,MODB,andMODA
pinsarelatchedintothesebitsontherisingedgeoftheresetsignal.TheROMCTLsignalallowsthesetting
of the ROMON bit in the MISC register thus controlling whether the internal Flash is visible in the
memory map. ROMON = 1 means the Flash is visible in the memory map. The state of the ROMCTL pin
is latched into the ROMON bit in the MISC register on the rising edge of the reset signal.
For further explanation on the modes refer to the HCS12 Multiplexed External Bus Interface (MEBI)
Block Guide.
Table 4-1 Mode Selection
BKGD =
MODC
PE6 =
MODB
PE5 =
MODA
PK7 =
ROMCTL
ROMON
Bit
Mode Description
0
0
0
X
1
Special Single Chip, BDM allowed and ACTIVE. BDM is
allowed in all other modes but a serial command is
required to make BDM active.
0
0
1
0
1
X
0
1
X
0
1
1
0
0
1
0
1
0
1
Emulation Expanded Narrow, BDM allowed
0
1
0
Special Test (Expanded Wide), BDM allowed
0
1
1
Emulation Expanded Wide, BDM allowed
1
0
0
Normal Single Chip, BDM allowed
1
0
1
Normal Expanded Narrow, BDM allowed
1
1
0
X
1
Peripheral; BDM allowed but bus operations would cause
bus conflicts (must not be used)
1
1
1
0
1
0
1
Normal Expanded Wide, BDM allowed
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
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MC9S12DG256BMPV 功能描述:IC MCU 256K FLASH 25MHZ 112-LQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:HCS12 標準包裝:250 系列:56F8xxx 核心處理器:56800E 芯體尺寸:16-位 速度:60MHz 連通性:CAN,SCI,SPI 外圍設備:POR,PWM,溫度傳感器,WDT 輸入/輸出數:21 程序存儲器容量:40KB(20K x 16) 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:6K x 16 電壓 - 電源 (Vcc/Vdd):2.25 V ~ 3.6 V 數據轉換器:A/D 6x12b 振蕩器型:內部 工作溫度:-40°C ~ 125°C 封裝/外殼:48-LQFP 包裝:托盤 配用:MC56F8323EVME-ND - BOARD EVALUATION MC56F8323
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