參數(shù)資料
型號: MC9S08MM128VLH
廠商: Freescale Semiconductor
文件頁數(shù): 7/52頁
文件大?。?/td> 0K
描述: IC MCU 8BIT 128K FLASH 64LQFP
標(biāo)準(zhǔn)包裝: 160
系列: S08
核心處理器: S08
芯體尺寸: 8-位
速度: 48MHz
連通性: I²C,SCI,SPI,USB
外圍設(shè)備: LVD,POR,PWM,WDT
輸入/輸出數(shù): 33
程序存儲器容量: 128KB(128K x 8)
程序存儲器類型: 閃存
RAM 容量: 12K x 8
電壓 - 電源 (Vcc/Vdd): 1.8 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 6x16b,D/A 1x12b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 105°C
封裝/外殼: 64-LQFP
包裝: 托盤
Electrical Characteristics
Freescale Semiconductor
15
2.3
Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package thermal resistance. Power
dissipation on I/O pins is usually small compared to the power dissipation in on-chip logic and it is user-determined rather than
being controlled by the MCU design. In order to take PI/O into account in power calculations, determine the difference between
actual pin voltage and VSS or VDD and multiply by the pin current for each I/O pin. Except in cases of unusually high pin current
(heavy loads), the difference between pin voltage and VSS or VDD will be very small.
The average chip-junction temperature (TJ) in C can be obtained from:
TJ = TA + (PD JA)
Eqn. 1
where:
TA = Ambient temperature, C
JA = Package thermal resistance, junction-to-ambient, C/W
PD = Pint PI/O
Pint = IDD VDD, Watts — chip internal power
PI/O = Power dissipation on input and output pins — user determined
Table 6. Thermal Characteristics
#
Symbol
Rating
Value
Unit
1TA
Operating temperature range (packaged):
C
MC9S08MM128
–40 to 105
MC9S08MM64
–40 to 105
MC9S08MM32
–40 to 105
MC9S08MM32A
–40 to 105
2TJMAX
Maximum junction temperature
135
C
3
JA
Thermal resistance1,2,3,4 Single-layer board — 1s
1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting
site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and
board thermal resistance.
2 Junction to Ambient Natural Convection
3 1s — Single layer board, one signal layer
4 2s2p — Four layer board, 2 signal and 2 power layers
C/W
81-pin MBGA
77
80-pin LQFP
55
64-pin LQFP
68
4
JA
Thermal resistance1, 2, 3, 4 Four-layer board — 2s2p
C/W
81-pin MBGA
47
80-pin LQFP
40
64-pin LQFP
49
Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
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