參數(shù)資料
型號(hào)： MC9S08JE128CLK
廠商： FREESCALE SEMICONDUCTOR INC
元件分類(lèi)： 微控制器/微處理器
英文描述： 8-BIT, FLASH, 48 MHz, MICROCONTROLLER, PQFP80
封裝： 12 X 12 MM, ROHS COMPLIANT, LQFP-80
文件頁(yè)數(shù)： 6/44頁(yè)
文件大?。?/td> 1008K
代理商： MC9S08JE128CLK
Preliminary Electrical Characteristics
Freescale Semiconductor
14
2.3
Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package thermal resistance. Power
dissipation on I/O pins is usually small compared to the power dissipation in on-chip logic and it is user-determined rather than
being controlled by the MCU design. In order to take PI/O into account in power calculations, determine the difference between
actual pin voltage and VSS or VDD and multiply by the pin current for each I/O pin. Except in cases of unusually high pin current
(heavy loads), the difference between pin voltage and VSS or VDD will be very small.
The average chip-junction temperature (TJ) in °C can be obtained from:
TJ = TA + (PD × θJA)
Eqn. 1
where:
TA = Ambient temperature, °C
θ
JA = Package thermal resistance, junction-to-ambient, °C/W
PD = Pint + PI/O
Pint = IDD × VDD, Watts — chip internal power
PI/O = Power dissipation on input and output pins — user determined
For most applications, PI/O << Pint and can be neglected. An approximate relationship between PD and TJ (if PI/O is neglected)
is:
PD = K ÷ (TJ + 273°C)
Eqn. 2
Table 6. Thermal Characteristics
#
Symbol
Rating
Value
Unit
1TA
Operating temperature range (packaged):
°C
MC9S08JE128
–40 to 105
MC9S08JE64
–40 to 105
2TJMAX
Maximum junction temperature
135
°C
3
θ
JA
Thermal resistance1,2,3,4 Single-layer board — 1s
1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting
site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and
board thermal resistance.
2 Junction to Ambient Natural Convection
3 1s — Single layer board, one signal layer
4 2s2p — Four layer board, 2 signal and 2 power layers
°C/W
81-pin MBGA
77
80-pin LQFP
55
64-pin LQFP
68
4
θ
JA
Thermal resistance1, 2, 3, 4 Four-layer board — 2s2p
°C/W
81-pin MBGA
47
80-pin LQFP
40
64-pin LQFP
49
Preliminary — Subject to Change
相關(guān)PDF資料
PDF描述
MC9S08JE128VLK 8-BIT, FLASH, 48 MHz, MICROCONTROLLER, PQFP80
MC9S08JE64CLH 8-BIT, FLASH, 48 MHz, MICROCONTROLLER, PQFP64
MC9S08JM32CGTE 8-BIT, FLASH, 48 MHz, MICROCONTROLLER, QCC48
MC9S08JM32CQHE 8-BIT, FLASH, 48 MHz, MICROCONTROLLER, PQFP64
MC9S08JM60CGTE 8-BIT, FLASH, 48 MHz, MICROCONTROLLER, QCC48
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MC9S08JE128CMB 功能描述:8位微控制器 -MCU 8BIT 128K FLASH RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
MC9S08JE128VLH 功能描述:8位微控制器 -MCU 8BIT 128K FLASH RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
MC9S08JE128VLK 功能描述:8位微控制器 -MCU 8BIT 128K FLASH RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
MC9S08JE128VMB 功能描述:8位微控制器 -MCU 8BIT 128K FLASH RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
MC9S08JE64CLH 功能描述:8位微控制器 -MCU 8BIT 64K FLASH RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
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