參數(shù)資料
型號(hào)： MC9S08AC128CFGE
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 5/40頁(yè)
文件大小： 0K
描述： MCU 128K FLASH 8K RAM 44-LQFP
標(biāo)準(zhǔn)包裝： 160
系列： S08
核心處理器： S08
芯體尺寸： 8-位
速度： 40MHz
連通性： I²C，LIN，SCI，SPI
外圍設(shè)備： LVD，POR，PWM，WDT
輸入/輸出數(shù)： 38
程序存儲(chǔ)器容量： 128KB（128K x 8）
程序存儲(chǔ)器類型： 閃存
RAM 容量： 8K x 8
電壓 - 電源 (Vcc/Vdd)： 2.7 V ~ 5.5 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 8x10b
振蕩器型： 內(nèi)部
工作溫度： -40°C ~ 85°C
封裝/外殼： 44-LQFP
包裝： 托盤
產(chǎn)品目錄頁(yè)面： 727 (CN2011-ZH PDF)
配用： DEMOACKIT-ND - KIT DEMO KIT FOR DC9S08A
DEMOJM-ND - KIT DEMO FOR JM MCU FAMILY
Chapter 3 Electrical Characteristics and Timing Specifications
MC9S08AC128 MCU Series Data Sheet, Rev. 4
Freescale Semiconductor
13
3.4
Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package thermal resistance. Power
dissipation on I/O pins is usually small compared to the power dissipation in on-chip logic and it is user-determined rather than
being controlled by the MCU design. In order to take PI/O into account in power calculations, determine the difference between
actual pin voltage and VSS or VDD and multiply by the pin current for each I/O pin. Except in cases of unusually high pin current
(heavy loads), the difference between pin voltage and VSS or VDD will be very small.
The average chip-junction temperature (TJ) in C can be obtained from:
TJ = TA + (PD JA)
Eqn. 3-1
where:
TA = Ambient temperature, C
JA = Package thermal resistance, junction-to-ambient, C/W
PD = Pint PI/O
Pint = IDD VDD, Watts — chip internal power
PI/O = Power dissipation on input and output pins — user determined
For most applications, PI/O Pint and can be neglected. An approximate relationship between PD and TJ (if PI/O is neglected)
is:
PD = K (TJ + 273C)
Eqn. 3-2
Table 3-3. Thermal Characteristics
Rating
Symbol
Value
Unit
Operating temperature range (packaged)
TA
TL to TH
–40 to 125
C
Maximum junction temperature
TJ
150
C
Thermal resistance 1,2,3,4
80-pin LQFP
1s
2s2p
64-pin QFP
1s
2s2p
48-pin QFN
1s
2s2p
44-pin LQFP
1s
2s2p
1 Junction temperature is a function of die size, on-chip power dissipation, package thermal
resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation
of other components on the board, and board thermal resistance.
2 Junction to Ambient Natural Convection
3 1s - Single Layer Board, one signal layer
4 2s2p - Four Layer Board, 2 signal and 2 power layers
JA
61
47
57
43
81
28
73
56
C/W
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