參數(shù)資料
型號: MC92600ZTB
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: SPECIALTY MICROPROCESSOR CIRCUIT, PBGA196
封裝: 15 X 15 MM, 1.60 MM HEIGHT, 1 MM PITCH, PLASTIC, MABGA-196
文件頁數(shù): 44/98頁
文件大小: 1018K
代理商: MC92600ZTB
MOTOROLA
Chapter 4. System Design Considerations
4-7
Decoupling Recommendations
capacitor, and nally the 1
resistor to Vdd on the 1.8V power plane. The capacitors are
connected from PLLAVDD to the ground plane. Use ceramic chip capacitors with the
highest possible self-resonant frequency. All traces should be kept short, wide and direct.
Figure 4-1. PLL Power Supply Filter Circuit
4.8
Decoupling Recommendations
The MC92600 requires a clean, tightly regulated source of power to ensure low jitter on
transmit, and reliable recovery of data in the receiver. An appropriate decoupling scheme is
outlined below.
Only surface mount technology (SMT) capacitors should be used, to minimize
inductance. Connections from all capacitors to power and ground should be done
with multiple vias to further reduce inductance.
The board should have about 10 x 10nF SMT ceramic chip capacitors as close as
possible to the 1.8V (Vdd and XVdd) balls of the device. The board should also have
about 10 x 10nF SMT ceramic chip capacitors as close as possible to the 3.3V
(OVdd) balls of the device. Where the board has blind vias, these capacitors should
be placed directly below the MC92600 supply and ground connections. Where the
board does not have blind vias, these capacitors should be placed in a ring around
the MC92600, as close to the supply and ground connections as possible.
A 1uF ceramic chip capacitor should exist on each side of the MC92600 device. This
should be done for both the 1.8V supply and the 3.3V supply.
Between the MC92600 device and the voltage regulator should be a 10uF, low
equivalent series resistance (ESR) SMT tantalum chip capacitor, and a 100uF, low
ESR SMT tantalum chip capacitor. This should be done for both the 1.8V supply and
the 3.3V supply.
VDD
1
0.01 F
PLLAVDD
1 F
GND
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