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SEMICONDUCTOR TECHNICAL DATA
Motorola, Inc. 1995
1
11/93
REV 3
The MC88913 is a high–speed, low power, hex divide–by–two D–type
flip–flop with two inverting and four non–inverting outputs that have
closely matched propagation delays. With a TTL compatible buffered
clock input that is common to all flip–flops, the MC88913 is ideal for use in
high–frequency systems as a clock driver, providing multiple outputs that
are synchronous.
Minimum Clock Input fMAX of 110MHz
TTL Compatible Positive Edge–Triggered Clock
Matched Outputs for Synchronous Applications
Outputs Source/Sink 24mA
Part–to–Part Skew of Less Than 4.0ns
Guaranteed Rise and Fall Times for a Given Capacitive Load
14
1
VCC
GND
13
2
GND
CLK
12
3
Q5
Q0
11
4
Q4
Q1
10
5
Q3
Q2
9
6
GND
GND
8
7
GND
GND
Pinout: 14–Lead Plastic
(Top View)
MAXIMUM RATINGS*
Symbol
Parameter
Value
Units
VCC
DC Supply Voltage (Referenced to GND)
–0.5 to +7.0
V
Vin
DC Input Voltage (Referenced to GND)
–0.5 to VCC + 0.5
V
Vout
DC Output Voltage (Referenced to GND)
–0.5 to VCC + 0.5
±
20
V
Iin
DC Input Current, per Pin
mA
Iout
DC Output Sink/Source Current, per Pin
±
50
mA
ICC
DC VCC or GND Current per Output Pin
±
50
mA
PD
Power Dissipation in Still Air
Plastic Package**
SOIC Package**
750
500
mW
Tstg
Storage Temperature
–65 to +150
°
C
TL
Lead Temperature, 1mm from Case for 10s (Plastic or SOIC
Package)
260
°
C
* Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the
Recommended Operating Conditions.
** Derating:
Plastic Package: –10mW/
°
C from 65
°
C to 125
°
C
SOIC Package:
–7.0mW/
°
C from 65
°
C to 125
°
C
LOW SKEW CMOS
CLOCK DRIVER
N SUFFIX
PLASTIC PACKAGE
CASE 646–06
1
14
1
14
D SUFFIX
PLASTIC PACKAGE
CASE 751A–03