參數(shù)資料
型號(hào)： MC8641VU1333GB
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： MICROPROCESSOR, CBGA1023
封裝： 33 X 33 MM, ROHS COMPLIANT, CERAMIC, BGA-1023
文件頁數(shù)： 35/140頁
文件大小： 1484K
代理商： MC8641VU1333GB
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 0
Freescale Semiconductor
13
Power Characteristics
3
Power Characteristics
The power dissipation for the dual core MPC8641D device is shown in Table 4.
Table 4. MPC8641D Power Dissipation (Dual Core)
Power Mode
Core Frequency
(MHz)
Platform
Frequency (MHz)
VDD_Coren,
VDD_PLAT
(Volts)
Junction
Temperature
Power
(Watts)
Notes
Typical
1500 MHz
600 MHz
1.1 V
65 oC
32.1
1, 2
Thermal
105 oC
43.4
1, 3
Maximum
49.9
1, 4
Typical
1333 MHz
533 MHz
1.05 V
65 oC
23.9
1, 2
Thermal
105 oC
30.0
1, 3
Maximum
34.1
1, 4
Typical
1250 MHz
500 MHz
1.05 V
65 oC
23.9
1, 2
Thermal
105 oC
30.0
1, 3
Maximum
34.1
1, 4
Typical
1000 MHz
400 MHz
1.05 V
65 oC
23.9
1, 2
Thermal
105 oC
30.0
1, 3
Maximum
34.1
1, 4
Typical
1000 MHz
500 MHz
0.95 V,
1.05 V
65 oC
16.2
1, 2, 5
Thermal
105 oC
21.8
1, 3, 5
Maximum
25.0
1, 4, 5
Notes:
1. These values specify the power consumption at nominal voltage and apply to all valid processor bus frequencies and
configurations. The values do not include power dissipation for I/O supplies.
2. Typical power is an average value measured at the nominal recommended core voltage (VDD_Coren) and 65°C junction
temperature (see Table 2)while running the Dhrystone 2.1 benchmark and achieving 2.3 Dhrystone MIPs/MHz with one core
at 100% efficiency and the second core at 65% efficiency.
3. Thermal power is the average power measured at nominal core voltage (VDD_Coren) and maximum operating junction
temperature (see Table 2) while running the Dhrystone 2.1 benchmark and achieving 2.3 Dhrystone MIPs/MHz on both
cores and a typical workload on platform interfaces.
4. Maximum power is the maximum power measured at nominal core voltage (VDD_Coren) and maximum operating junction
temperature (see Table 2) while running a test which includes an entirely L1-cache-resident, contrived sequence of
instructions which keep all the execution units maximally busy on both cores.
5. These power numbers are for Part Number MC8641Dxx1000NX only. VDD_Coren = 0.95 V and VDD_PLAT = 1.05 V.
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MC8641VU1333JB 功能描述:微處理器 - MPU G8 REV 2.0 1.05V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MC8641VU1333JC 功能描述:微處理器 - MPU G8 REV 2.1 1.05V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MC8641VU1333JE 功能描述:微處理器 - MPU G8 REV3.0 1.05V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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