MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 0
Freescale Semiconductor
109
Clocking
20. The pins in this section are reset configuration pins. Each pin has a weak internal pull-up P-FET which is enabled only when
the processor is in the reset state. This pull-up is designed such that it can be overpowered by an external 4.7-k
Ω pull-down
resistor. However, if the signal is intended to be high after reset, and if there is any device on the net which might pull down
the value of the net at reset, then a pullup or active driver is needed.
21. Should be pulled down at reset if platform frequency is at 400 MHz.
22. These pins require 4.7-k
Ω pull-up or pull-down resistors and must be driven as they are used to determine PLL configuration
ratios at reset.
23. This output is actively driven during reset rather than being tri-stated during reset.
24 These JTAG pins have weak internal pull-up P-FETs that are always enabled.
25. This pin should NOT be pulled down (or driven low) during reset.
26.These are test signals for factory use only and must be pulled up (100-
Ω to 1- kΩ.) to OVDD for normal machine operation.
27. Dn_MDIC[0] should be connected to ground with an 18-
Ω resistor +/- 1-Ω and Dn_MDIC[1] should be connected Dn_GVDD
with an 18-
Ω resistor +/- 1-Ω. These pins are used for automatic calibration of the DDR IOs.
28. Pin N18 is recommended as a reference point for determining the voltage of VDD_PLAT and is hence considered as the
VDD_PLAT sensing voltage and is called SENSEVDD_PLAT.
29. Pin P18 is recommended as the ground reference point for SENSEVDD_PLAT and is called SENSEVSS_PLAT.
30.This pin should be pulled to ground with a 200-
Ω resistor.
31.These pins are connected to the power/ground planes internally and may be used by the core power supply to improve
tracking and regulation.
32. Must be tied low if unused
33. These pins may be used as defined functional reset configuration pins in the future. Please include a resistor pull up/down
option to allow flexibility of future designs.
34. Used as serial data output for SRIO 1x/4x link.
35. Used as serial data input for SRIO 1x/4x link.
36.This pin requires an external 4.7-k
Ω pull-down resistor to prevent PHY from seeing a valid Transmit Enable before it is actively
driven.
37.This pin is only an output in FIFO mode when used as Rx Flow Control.
38.This pin functions as cfg_dram_type[0 or 1] at reset and MUST BE VALID BEFORE HRESET ASSERTION in device sleep
mode.
39. Should be pulled to ground if unused (such as in FIFO, MII and RMII modes).
41. The phase between the output clocks TSEC1_GTX_CLK and TSEC2_GTX_CLK (ports 1 and 2) is no more than 100 ps. The
phase between the output clocks TSEC3_GTX_CLK and TSEC4_GTX_CLK (ports 3 and 4) is no more than 100 ps.
42. For systems which boot from Local Bus (GPCM)-controlled flash, a pullup on LGPL4 is required.
Special Notes for Single Core Device:
S1. Solder ball for this signal will not be populated in the single core package.
S2. The PLL filter from VDD_Core1 to AVDD_Core1 should be removed. AVDD_Core1 should be pulled to ground with a weak
(2–10 k
S3. This pin should be pulled to GND for the single core device.
S4. No special requirement for this pin on single core device. Pin should be tied to power supply as directed for dual core.
18 Clocking
This section describes the PLL configuration of the MPC8641. Note that the platform clock is identical to
the MPX clock.