參數(shù)資料
型號： MC8641DVU1500KE
廠商： Freescale Semiconductor
文件頁數(shù)： 46/130頁
文件大?。?/td> 0K
描述： IC MPU DUAL CORE E600 1023FCCBGA
標準包裝： 1
系列： MPC86xx
處理器類型： 32-位 MPC86xx PowerPC
速度： 1.5GHz
電壓： 1.1V
安裝類型： 表面貼裝
封裝/外殼： 1023-BCBGA，F(xiàn)CCBGA
供應商設備封裝： 1023-FCCBGA（33x33）
包裝： 托盤
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 2
22
Freescale Semiconductor
DDR and DDR2 SDRAM
Table 15 provides the recommended operating conditions for the DDR SDRAM component(s) when
Dn_GVDD(typ) = 2.5 V.
Table 16 provides the DDR capacitance when Dn_GV
DD (typ)=2.5 V.
Table 17 provides the current draw characteristics for MVREF.
Table 15. DDR SDRAM DC Electrical Characteristics for D
n_GVDD (typ) = 2.5 V
Parameter/Condition
Symbol
Min
Max
Unit
Notes
I/O supply voltage
D
n_GVDD
2.375
2.625
V
1
I/O reference voltage
D
n_MVREF
0.49
× Dn_GVDD
0.51
× Dn_GVDD
V2
I/O termination voltage
VTT
D
n_MVREF – 0.04
D
n_MVREF + 0.04
V
3
Input high voltage
VIH
D
n_MVREF + 0.15
D
n_GVDD + 0.3
V
—
Input low voltage
VIL
–0.3
D
n_MVREF– 0.15
V
—
Output leakage current
IOZ
–50
50
μA4
Output high current (VOUT = 1.95 V)
IOH
–16.2
—
mA
—
Output low current (VOUT = 0.35 V)
IOL
16.2
—
mA
—
Notes:
1. D
n_GVDD is expected to be within 50 mV of the DRAM Dn_GVDD at all times.
2. MVREF is expected to be equal to 0.5 × Dn_GVDD, and to track Dn_GVDD DC variations as measured at the receiver.
Peak-to-peak noise on D
n_MVREF may not exceed ±2% of the DC value.
3. VTT is not applied directly to the device. It is the supply to which far end signal termination is made and is expected to be
equal to D
n_MVREF. This rail should track variations in the DC level of Dn_MVREF.
4. Output leakage is measured with all outputs disabled, 0 V
≤ VOUT ≤ Dn_GVDD.
Table 16. DDR SDRAM Capacitance for D
n_GVDD (typ) = 2.5 V
Parameter/Condition
Symbol
Min
Max
Unit
Notes
Input/output capacitance: DQ, DQS
CIO
68
pF
1
Delta input/output capacitance: DQ, DQS
CDIO
—0.5
pF
1
Note:
1. This parameter is sampled. D
n_GVDD = 2.5 V ± 0.125 V, f = 1 MHz, TA = 25°C, VOUT = Dn_GVDD/2,
VOUT (peak-to-peak) = 0.2 V.
Table 17. Current Draw Characteristics for MVREF
Parameter / Condition
Symbol
Min
Max
Unit
Note
Current draw for MVREF
IMVREF
—
500
μA1
1. The voltage regulator for MVREF must be able to supply up to 500 μA current.
相關PDF資料
PDF描述
MC8641DHX1500KE IC DUAL CORE PROCESSOR 1023-CBGA
FMC43DRYN CONN EDGECARD 86POS DIP .100 SLD
MC68LC060ZU66 IC MPU 32BIT 68K 66MHZ 304-TBGA
MC8640DTHX1067NE IC MPU DUAL CORE E600 1023FCCBGA
FMC43DRYH CONN EDGECARD 86POS DIP .100 SLD
相關代理商/技術參數(shù)
參數(shù)描述
MC8641DVU1500N 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications
MC8641HX1000G 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications
MC8641HX1000GB 功能描述:微處理器 - MPU G8 REV 2.0 1.05V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MC8641HX1000GC 功能描述:IC MPU SGL E600 CORE 994FCCBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC86xx 標準包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點:- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA，F(xiàn)CBGA 供應商設備封裝:783-FCPBGA（29x29） 包裝:托盤
MC8641HX1000GE 功能描述:微處理器 - MPU G8 REV 3.0 1.05V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
發(fā)布緊急采購，3分鐘左右您將得到回復。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*