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| 型號(hào)： | MC8641DHX1500GB |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | MICROPROCESSOR, CBGA1023 |
| 封裝： | 33 X 33 MM, ROHS COMPLIANT, CERAMIC, BGA-1023 |
| 文件頁數(shù)： | 18/140頁 |
| 文件大?。?/td> | 1484K |
| 代理商： | MC8641DHX1500GB |
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MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 0
114
Freescale Semiconductor
Thermal
19.2 Thermal Management Information
This section provides thermal management information for the high coefficient of thermal expansion
(HCTE) package for air-cooled applications. Proper thermal control design is primarily dependent on the
system-level design—the heat sink, airflow, and thermal interface material. The MPC8641 implements
several features designed to assist with thermal management, including the temperature diode. The
temperature diode allows an external device to monitor the die temperature in order to detect excessive
temperature conditions and alert the system; see Section 19.2.4, “Temperature Diode,” for more
information.
To reduce the die-junction temperature, heat sinks are required; due to the potential large mass of the heat
sink, attachment through the printed-circuit board is suggested. In any implementation of a heat sink
solution, the force on the die should not exceed ten pounds force (45 newtons). Figure 59 and Figure 52
show a spring clip through the board. Occasionally the spring clip is attached to soldered hooks or to a
plastic backing structure. Screw and spring arrangements are also frequently used.
Table 71. Package Thermal Characteristics1
Characteristic
Symbol
Value
Unit
Notes
Junction-to-ambient thermal resistance, natural convection, single-layer (1s) board
RθJA
18
°C/W
1, 2
Junction-to-ambient thermal resistance, natural convection, four-layer (2s2p) board
RθJA
13
°C/W
1, 3
Junction-to-ambient thermal resistance, 200 ft/min airflow, single-layer (1s) board
RθJMA
13
°C/W
1, 3
Junction-to-ambient thermal resistance, 200 ft/min airflow, four-layer (2s2p) board
RθJMA
9°C/W
1, 3
Junction-to-board thermal resistance
RθJB
5°C/W
4
Junction-to-case thermal resistance
RθJC
< 0.1
°C/W
5
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2. Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
3. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
5. This is the thermal resistance between die and case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1) with the calculated case temperature. Actual thermal resistance is less than 0.1 °C/W.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MC8641DHX1500H | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications |
| MC8641DHX1500J | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications |
| MC8641DHX1500K | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications |
| MC8641DHX1500KB | 功能描述:微處理器 - MPU G8 REV 2.0 1.1V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MC8641DHX1500KC | 功能描述:微處理器 - MPU G8 REV 2.1 1.1V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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