參數資料
型號: MC8641DHX1333JE
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 166.66 MHz, MICROPROCESSOR, CBGA1023
封裝: 33 X 33 MM, CERAMIC, BGA-1023
文件頁數: 118/130頁
文件大?。?/td> 1493K
代理商: MC8641DHX1333JE
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 2
88
Freescale Semiconductor
Package
16 Package
This section details package parameters and dimensions.
16.1
Package Parameters for the MPC8641
The package parameters are as provided in the following list. The package type is 33 mm
× 33 mm, 1023
pins. There are two package options: high-lead Flip Chip-Ceramic Ball Grid Array (FC-CBGA), and
lead-free (FC-CBGA).
For all package types:
Die size
12.1 mm
× 14.7 mm
Package outline
33 mm
× 33 mm
Interconnects
1023
Pitch
1 mm
Total Capacitor count
43 caps; 100 nF each
For high-lead FC-CBGA (package option: HCTE1 HX)
Maximum module height
2.97 mm
Minimum module height
2.47 mm
Solder Balls
89.5% Pb 10.5% Sn
Ball diameter (typical2)
0.60 mm
For RoHS lead-free FC-CBGA (package option: HCTE1 VU)
Maximum module height
2.77 mm
Minimum module height
2.27 mm
Solder Balls
95.5% Sn 4.0% Ag 0.5% Cu
Ball diameter (typical2)
0.60 mm
1 High-coefficient of thermal expansion
2 Typical ball diameter is before reflow
相關PDF資料
PDF描述
MC8641HX1000NB 32-BIT, 166.66 MHz, MICROPROCESSOR, CBGA1023
MC8641HX1000NE 32-BIT, 166.66 MHz, MICROPROCESSOR, CBGA1023
MC8641HX1250HB 32-BIT, 166.66 MHz, MICROPROCESSOR, CBGA1023
MC8641DVU1000NB 32-BIT, 166.66 MHz, MICROPROCESSOR, CBGA1023
MC8641HX1000NC 32-BIT, 166.66 MHz, MICROPROCESSOR, CBGA1023
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