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參數(shù)資料
| 型號(hào)： | MC8641DHX1250NB |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | MICROPROCESSOR, CBGA1023 |
| 封裝： | 33 X 33 MM, ROHS COMPLIANT, CERAMIC, BGA-1023 |
| 文件頁數(shù)： | 59/140頁 |
| 文件大小： | 1484K |
| 代理商： | MC8641DHX1250NB |
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MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 0
Freescale Semiconductor
25
DDR and DDR2 SDRAM
NOTE
For the ADDR/CMD setup and hold specifications in Table 21, it is
assumed that the Clock Control register is set to adjust the memory clocks
by 1/2 applied cycle.
MDQS epilogue end
tDDKHME
–0.6
0.6
ns
6
Note:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. Output hold time can
be read as DDR timing (DD) from the rising or falling edge of the reference clock (KH or KL) until the output went
invalid (AX or DX). For example, tDDKHAS symbolizes DDR timing (DD) for the time tMCK memory clock reference (K)
goes from the high (H) state until outputs (A) are setup (S) or output valid time. Also, tDDKLDX symbolizes DDR
timing (DD) for the time tMCK memory clock reference (K) goes low (L) until data outputs (D) are invalid (X) or data
output hold time.
2. All MCK/MCK referenced measurements are made from the crossing of the two signals ±0.1 V.
3. ADDR/CMD includes all DDR SDRAM output signals except MCK/MCK, MCS, and MDQ/MECC/MDM/MDQS.
4. Note that tDDKHMH follows the symbol conventions described in note 1. For example, tDDKHMH describes the DDR
timing (DD) from the rising edge of the MCK[n] clock (KH) until the MDQS signal is valid (MH). tDDKHMH can be
modified through control of the DQS override bits (called WR_DATA_DELAY) in the TIMING_CFG_2 register. This
will typically be set to the same delay as the clock adjust in the CLK_CNTL register. The timing parameters listed in
the table assume that these 2 parameters have been set to the same adjustment value. See the
MPC8641
Integrated Processor Reference Manual for a description and understanding of the timing modifications enabled by
use of these bits.
5. Determined by maximum possible skew between a data strobe (MDQS) and any corresponding bit of data (MDQ),
ECC (MECC), or data mask (MDM). The data strobe should be centered inside of the data eye at the pins of the
microprocessor.
6. All outputs are referenced to the rising edge of MCK[n] at the pins of the microprocessor. Note that tDDKHMP follows
the symbol conventions described in note 1.
7. Maximum DDR1 frequency is 400 MHz
8. Per the JEDEC spec the DDR2 duty cycle at 600 MHz is the average low and high cycle time values that are
defined as the average pulse widths calculated across any consecutive 200 pulses. Jitter can sometimes force
single low and high cycle times to drift from the average values. tJIT = ±125 ps.
9. Per the JEDEC spec the DDR2 duty cycle at 400 and 533 MHz is the low and high cycle time values.
Table 21. DDR SDRAM Output AC Timing Specifications (continued)
At recommended operating conditions.
Parameter
Symbol 1
Min
Max
Unit
Notes
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MC8641DHX1333G | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications |
| MC8641DHX1333H | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications |
| MC8641DHX1333J | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications |
| MC8641DHX1333JB | 功能描述:微處理器 - MPU G8 REV 2.0 1.05V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MC8641DHX1333JC | 功能描述:微處理器 - MPU G8 REV 2.1 1.05V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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