參數資料
型號: MC8640VU1250HC
廠商: Freescale Semiconductor
文件頁數: 47/130頁
文件大小: 0K
描述: MPU DUAL E600 994-FCCBGA
標準包裝: 1
系列: MPC86xx
處理器類型: 32-位 MPC86xx PowerPC
速度: 1.25GHz
電壓: 1.05V
安裝類型: 表面貼裝
封裝/外殼: 994-BCBGA,FCCBGA
供應商設備封裝: 994-FCCBGA(33x33)
包裝: 托盤
MPC8640 and MPC8640D Integrated Host Processor Hardware Specifications, Rev. 3
Freescale Semiconductor
23
DDR and DDR2 SDRAM
NOTE
For the ADDR/CMD setup and hold specifications in Table 21, it is
assumed that the Clock Control register is set to adjust the memory clocks
by 1/2 applied cycle.
MDQ/MECC/MDM output setup with respect to
MDQS
tDDKHDS,
tDDKLDS
ps
5
533 MHz
590
7
400 MHz
700
MDQ/MECC/MDM output hold with respect to
MDQS
tDDKHDX,
tDDKLDX
ps
5
533 MHz
590
7
400 MHz
700
MDQS preamble start
tDDKHMP
–0.5
× tMCK – 0.6
–0.5
× tMCK +0.6
ns
6
MDQS epilogue end
tDDKHME
–0.6
0.6
ns
6
Note:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. Output hold time can be read as DDR timing
(DD) from the rising or falling edge of the reference clock (KH or KL) until the output went invalid (AX or DX). For example,
tDDKHAS symbolizes DDR timing (DD) for the time tMCK memory clock reference (K) goes from the high (H) state until
outputs (A) are setup (S) or output valid time. Also, tDDKLDX symbolizes DDR timing (DD) for the time tMCK memory clock
reference (K) goes low (L) until data outputs (D) are invalid (X) or data output hold time.
2. All MCK/MCK referenced measurements are made from the crossing of the two signals ±0.1 V.
3. ADDR/CMD includes all DDR SDRAM output signals except MCK/MCK, MCS, and MDQ/MECC/MDM/MDQS.
4. Note that tDDKHMH follows the symbol conventions described in note 1. For example, tDDKHMH describes the DDR timing
(DD) from the rising edge of the MCK[n] clock (KH) until the MDQS signal is valid (MH). tDDKHMH can be modified through
control of the DQS override bits (called WR_DATA_DELAY) in the TIMING_CFG_2 register. This will typically be set to the
same delay as the clock adjust in the CLK_CNTL register. The timing parameters listed in the table assume that these 2
parameters have been set to the same adjustment value. See the
MPC8641 Integrated Processor Reference Manual for a
description and understanding of the timing modifications enabled by use of these bits.
5. Determined by maximum possible skew between a data strobe (MDQS) and any corresponding bit of data (MDQ), ECC
(MECC), or data mask (MDM). The data strobe should be centered inside of the data eye at the pins of the microprocessor.
6. All outputs are referenced to the rising edge of MCK[n] at the pins of the microprocessor. Note that tDDKHMP follows the
symbol conventions described in note 1.
7. Maximum DDR1 frequency is 400 MHz
8. Per the JEDEC spec the DDR2 duty cycle at 400 and 533 MHz is the low and high cycle time values.
Table 21. DDR SDRAM Output AC Timing Specifications (continued)
At recommended operating conditions (see Table 2).
Parameter
Symbol 1
Min
Max
Unit
Notes
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