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參數(shù)資料
| 型號： | MC8640DVU1000HE |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 1000 MHz, MICROPROCESSOR, CBGA1023 |
| 封裝： | 33 X 33 MM, ROHS COMPLIANT, CERAMIC, FCBGA-1023 |
| 文件頁數(shù)： | 15/130頁 |
| 文件大小： | 1495K |
| 代理商： | MC8640DVU1000HE |
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MPC8640 and MPC8640D Integrated Host Processor Hardware Specifications, Rev. 3
Freescale Semiconductor
111
Thermal
Heat generated on the active side of the chip is conducted through the silicon, then the heat sink attach
material (or thermal interface material), and finally to the heat sink where it is removed by forced-air
convection.
Because the silicon thermal resistance is quite small, the temperature drop in the silicon may be neglected
for a first-order analysis. Thus the thermal interface material and the heat sink conduction/convective
thermal resistances are the dominant terms.
19.2.2
Thermal Interface Materials
A thermal interface material is recommended at the package-to-heat sink interface to minimize the thermal
contact resistance. Figure 61 shows the thermal performance of three thin-sheet thermal-interface
materials (silicone, graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function
of contact pressure. As shown, the performance of these thermal interface materials improves with
increasing contact pressure. The use of thermal grease significantly reduces the interface thermal
resistance. That is, the bare joint results in a thermal resistance approximately seven times greater than the
thermal grease joint.
Often, heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board
(see Figure 59). Therefore, synthetic grease offers the best thermal performance, considering the low
interface pressure, and is recommended due to the high power dissipation of the MPC8640. Of course, the
selection of any thermal interface material depends on many factors—thermal performance requirements,
manufacturability, service temperature, dielectric properties, cost, and so on.
Figure 61. Thermal Performance of Select Thermal Interface Material
0
0.5
1
1.5
2
0
1020
30
40
50607080
Silicone Sheet (0.006 in.)
Bare Joint
Fluoroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
Contact Pressure (psi)
Spe
c
if
ic
Ther
m
a
lResi
st
anc
e
(K
-i
n.
2
/W
)
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MC8640DVU1000N | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications Addendum for the MC8640xTxxyyyyaC Series |
| MC8640DVU1000NC | 功能描述:微處理器 - MPU G8,REV2.1,0.95V,105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MC8640DVU1067H | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications Addendum for the MC8640xTxxyyyyaC Series |
| MC8640DVU1067N | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications Addendum for the MC8640xTxxyyyyaC Series |
| MC8640DVU1067NC | 功能描述:微處理器 - MPU G8,REV2.1 0.95V,105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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