參數(shù)資料
    型號: MC8640DHX1000HC
    廠商: FREESCALE SEMICONDUCTOR INC
    元件分類: 微控制器/微處理器
    英文描述: 32-BIT, 1000 MHz, MICROPROCESSOR, CBGA1023
    封裝: 33 X 33 MM, CERAMIC, FCBGA-1023
    文件頁數(shù): 117/130頁
    文件大?。?/td> 1495K
    代理商: MC8640DHX1000HC
    MPC8640 and MPC8640D Integrated Host Processor Hardware Specifications, Rev. 3
    Freescale Semiconductor
    87
    Package
    Random jitter is calibrated using a high pass filter with a low frequency corner at 20 MHz and a 20
    dB/decade roll-off below this. The required sinusoidal jitter specified in Section 15.7, “Receiver
    Specifications,is then added to the signal and the test load is replaced by the receiver being tested.
    16 Package
    This section details package parameters and dimensions.
    16.1
    Package Parameters for the MPC8640
    The package parameters are as provided in the following list. The package type is 33 mm
    × 33 mm, 1023
    pins. There are two package options: high-lead flip chip-ceramic ball grid array (FC-CBGA) and lead-free
    (FC-CBGA).
    For all package types:
    Die size
    12.1 mm
    × 14.7 mm
    Package outline
    33 mm
    × 33 mm
    Interconnects
    1023
    Pitch
    1 mm
    Total Capacitor count
    43 caps; 100 nF each
    For high-lead FC-CBGA (package option: HCTE1 HX)
    Maximum module height
    2.97 mm
    Minimum module height
    2.47 mm
    Solder Balls
    89.5% Pb 10.5% Sn
    Ball diameter (typical2)
    0.60 mm
    For RoHS lead-free FC-CBGA (package option: HCTE1 VU)
    Maximum module height
    2.77 mm
    Minimum module height
    2.27 mm
    Solder Balls
    95.5% Sn 4.0% Ag 0.5% Cu
    Ball diameter (typical2)
    0.60 mm
    1 High-coefficient of thermal expansion
    2 Typical ball diameter is before reflow
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