參數(shù)資料
型號(hào)： MC860SRCVR50D4R2
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 78/78頁(yè)
文件大?。?/td> 0K
描述： IC MCU POWERQUICC 50MHZ 357-PBGA
標(biāo)準(zhǔn)包裝： 1
系列： MPC8xx
處理器類(lèi)型： 32-位 MPC8xx PowerQUICC
速度： 50MHz
電壓： 3.3V
安裝類(lèi)型： 表面貼裝
封裝/外殼： 357-BBGA
供應(yīng)商設(shè)備封裝： 357-PBGA（25x25）
包裝： 剪切帶 (CT)
其它名稱： MC860SRCVR50D4R2CT
MPC860 PowerQUICC Family Hardware Specifications, Rev. 9
Freescale Semiconductor
9
Thermal Characteristics
Table 4 shows the thermal characteristics for the MPC860.
Table 4. MPC860 Thermal Resistance Data
Rating
Environment
Symbol
ZP
MPC860P
ZQ / VR
MPC860P
Unit
Mold Compound Thickness
0.85
1.15
mm
Junction-to-ambient 1
1 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
Natural convection
Single-layer board (1s)
RθJA
2
2 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
34
C/W
Four-layer board (2s2p)
RθJMA
3
3 Per JEDEC JESD51-6 with the board horizontal.
22
Airflow (200 ft/min)
Single-layer board (1s)
RθJMA
27
Four-layer board (2s2p)
RθJMA
18
Junction-to-board 4
4 Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured
on the top surface of the board near the package.
RθJB
14
13
Junction-to-case 5
5 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed pad
packages where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated value from
the junction to the exposed pad without contact resistance.
RθJC
68
Junction-to-package top 6
6 Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2.
Natural convection
ΨJT
22
相關(guān)PDF資料
PDF描述
IDT7008S25J8 IC SRAM 512KBIT 25NS 84PLCC
AMC31DTEI CONN EDGECARD 62POS .100 EYELET
MC860DECVR50D4R2 IC MCU POWERQUICC 50MHZ 357-PBGA
FMC65DRXS-S734 CONN EDGECARD 130PS DIP .100 SLD
FMC49DRAS-S734 CONN EDGECARD 98POS .100 R/A SLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MC860SRCZQ50D4R2 功能描述:微處理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MC861 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:INTEGRATED CIRCUITS
MC8610PX1066JB 功能描述:微處理器 - MPU REV 1.1 8610 1.0V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MC8610PX1066JZ 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC8610 Integrated Host Processor Hardware Specifications
MC8610PX1067G 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*