
Device
Operating
Temperature Range
Package
SEMICONDUCTOR
TECHNICAL DATA
ELECTRONIC IGNITION
CONTROL CIRCUIT
ORDERING INFORMATION
MCCF79076
MC79076DW
T
A
= – 30
°
to +125
°
C
Flip–Chip
SO–16L
DW SUFFIX
PLASTIC PACKAGE
CASE 751G
(SO–16L)
FLIP–CHIP CONFIGURATION
1
BUMP CONNECTIONS
1. High Ground
2. Output Current Limt
3. Dwell Output
4. Supply
5. Low Ground
6. Reference Dwell Input
7. Advance Input
8. Bias Voltage
9. Est Input
10. Reference Output
11. Bypass Input
12. 900 RPMDetector
13. Dwell Control
Top View
(Bump Side)
2
3
4
5
6
13
12
11
10
9
7
8
1
The MCCF79076, in conjunction with an appropriate Motorola Power
Darlington Transistor, provides an economical solution for automotive
ignition applications. The MCCF79076 offers optimum performance by
providing closed loop operation of the Power Darlington in controlling the
ignition coil current.
The MCCF79076 incorporates Flip–Chip Technology which involves the
formation of solder bumps, rather than traditional wire bonds, to establish
mechanical and electrical contact to the semiconductor chip. This process
affords a unique device having improved reliability at elevated operating
temperatures.
Solder Bumped for Flip–Chip Assembly
Ignition Coil Voltage Internally Limited to 375 V
Coil Current Limiting to 7.5 A
Output On–Time (Dwell) Control
Dwell Feedback Control to Sense Coil Variation
Hall Sensor Input
– 30
°
C
≤
T
A
≤
+140
°
C Ambient Operating Temperature
Simplified Block Diagram
and Application Circuit
Est. Input
Ref. Output
Bypass Input
Hall
Sensor
Input
13
12
11
10
9
8
7
6
5
4
3
2
1
Logic and
Control
Output
Reference
Generator
V
CC
To Ignition
Coil
This document contains information on a product under development. Motorola reserves the
right to change or discontinue this product without notice.
Motorola, Inc. 1996
Issue 0
F
Freescale Semiconductor, Inc.
Go to: www.freescale.com
n
.