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MC74VHC1G50
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8
PACKAGE DIMENSIONS
SOT23--5/TSOP--5/SC59--5
DT SUFFIX
5--LEAD PACKAGE
CASE 483--01
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. A AND B DIMENSIONS DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
DIM
A
B
C
D
G
H
J
K
L
M
S
MIN
2.90
1.30
0.90
0.25
0.85
0.013
0.10
0.20
1.25
MAX
3.10 0.1142 0.1220
1.70 0.0512 0.0669
1.10 0.0354 0.0433
0.50 0.0098 0.0197
1.05 0.0335 0.0413
0.100 0.0005 0.0040
0.26 0.0040 0.0102
0.60 0.0079 0.0236
1.55 0.0493 0.0610
10
0
3.00 0.0985 0.1181
MIN
MAX
INCHES
MILLIMETERS
0
10
2.50
0.05 (0.002)
1
2
3
5
4
S
A
G
L
B
D
H
C
K
M
J
_
_
Figure 12.
THIN SOT23--5/TSOP--5/SC59--5
*ForadditionalinformationonourPb--Freestrategyandsoldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.7
0.028
1.0
0.039
0.95
0.037
2.4
0.094
1.9
0.074
mm
inches
SCALE 10:1
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