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參數(shù)資料
| 型號： | MC74HC4067ADWR2G |
| 廠商： | ON Semiconductor |
| 文件頁數(shù)： | 3/12頁 |
| 文件大小： | 0K |
| 描述： | IC MUX/DEMUX/QUAD SWITCH 24SOIC |
| 標準包裝： | 1,000 |
| 功能： | 多路復用器/多路分解器 |
| 電路： | 1 x 4:1 |
| 導通狀態(tài)電阻： | 140 歐姆 |
| 電壓電源： | 單電源 |
| 電壓 - 電源，單路/雙路(±)： | 2 V ~ 6 V |
| 電流 - 電源： | 4µA |
| 工作溫度： | -55°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 24-SOIC（0.295"，7.50mm 寬） |
| 供應商設備封裝： | 24-SOIC |
| 包裝： | 帶卷 (TR) |
MC74HC4067A
http://onsemi.com
11
PACKAGE DIMENSIONS
SOIC24 WB
CASE 751E04
ISSUE F
b
M
0.25
C
SEATING
PLANE
A1
M
L
DETAIL A
END VIEW
h
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b AND c APPLY TO THE FLAT SEC-
TION OF THE LEAD AND ARE MEASURED
BETWEEN 0.10 AND 0.25 FROM THE LEAD TIP.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH, PROTRUSIONS OR GATE BURRS SHALL
NOT EXCEED 0.15 mm PER SIDE. INTERLEAD
FLASH OR PROTRUSION SHALL NOT EXCEED
0.25 PER SIDE. DIMENSIONS D AND E1 ARE
DETERMINED AT DATUM H.
5. A1 IS DEFINED AS THE VERTICAL DISTANCE
FROM THE SEATING PLANE TO THE LOWEST
POINT ON THE PACKAGE BODY.
NOTE 3
PIN 1
12
1
24
13
TOP VIEW
DIM
MIN
MAX
MILLIMETERS
A
2.35
2.65
b
0.35
0.49
e
1.27 BSC
h
0.25
0.75
c
0.23
0.32
A1
0.13
0.29
L
0.41
0.90
M
0
8
_
D
E1
SIDE VIEW
11.00
24X
0.52
24X
1.62
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
E
10.30 BSC
RECOMMENDED
INDICATOR
A
B
0.25 C
24X
B
A
C
A
NOTE 5
x 45
c
NOTE 3
DETAIL A
C
H
D
15.25
15.54
E1
7.40
7.60
E
S
e
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