VCC DC Supply Voltage *0.5 to" />
參數(shù)資料
型號: MC74HC1G00DTT1
廠商: ON Semiconductor
文件頁數(shù): 2/6頁
文件大?。?/td> 0K
描述: IC GATE NAND SGL 2INPUT 5TSOP
產(chǎn)品變化通告: LTB Notification 03/Jan/2008
標準包裝: 1
系列: 74HC
邏輯類型: 與非門
電路數(shù): 1
輸入數(shù): 2
電源電壓: 2 V ~ 6 V
電流 - 靜態(tài)(最大值): 1µA
輸出電流高,低: 2.6mA,2.6mA
邏輯電平 - 低: 0.5 V ~ 1.8 V
邏輯電平 - 高: 1.5 V ~ 4.2 V
額定電壓和最大 CL 時的最大傳播延遲: 17ns @ 6V,50pF
工作溫度: -55°C ~ 125°C
安裝類型: 表面貼裝
供應商設備封裝: 5-TSOP
封裝/外殼: 6-TSOP(0.059",1.50mm 寬)5 引線
包裝: 剪切帶 (CT)
其它名稱: MC74HC1G00DTTOSCT
MC74HC1G00
http://onsemi.com
2
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage
*0.5 to )7.0
V
VIN
DC Input Voltage
*0.5 to VCC )0.5
V
VOUT
DC Output Voltage
*0.5 to VCC )0.5
V
IIK
DC Input Diode Current
$20
mA
IOK
DC Output Diode Current
$20
mA
IOUT
DC Output Sink Current
$12.5
mA
ICC
DC Supply Current per Supply Pin
$25
mA
TSTG
Storage Temperature Range
*65 to )150
_C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
_C
TJ
Junction Temperature Under Bias
)150
_C
qJA
Thermal Resistance
SC705/SC88A (Note 1)
TSOP5
350
230
_C/W
PD
Power Dissipation in Still Air at 85_CSC705/SC88A
TSOP5
150
200
mW
MSL
Moisture Sensitivity
Level 1
FR
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V0 @ 0.125 in
VESD
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
u2000
u200
N/A
V
ILATCHUP
Latchup Performance
Above VCC and Below GND at 125_C (Note 5)
$500
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mmby1 inch, 2 ounce copper trace with no air flow.
2. Tested to EIA/JESD22A114A.
3. Tested to EIA/JESD22A115A.
4. Tested to JESD22C101A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
DC Supply Voltage
2.0
6.0
V
VIN
DC Input Voltage
0.0
VCC
V
VOUT
DC Output Voltage
0.0
VCC
V
TA
Operating Temperature Range
*55
)125
_C
tr , tf
Input Rise and Fall Time
VCC = 2.0 V
VCC = 3.0 V
VCC = 4.5 V
VCC = 6.0 V
0
1000
600
500
400
ns
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature °C
Time, Hours
Time, Years
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
1
10
100
1000
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
Figure 3. Failure Rate vs. Time Junction Temperature
NORMALIZED
F
AILURE
RA
TE
TIME, YEARS
T
J=
1
30
_C
T
J=
1
20
_C
T
J=
1
10
_C
T
J=
1
00
_C
T
J=
9
0_
C
T
J=
8
0_
C
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