參數(shù)資料
型號(hào)： MC74HC164AN
廠商： MOTOROLA INC
元件分類： 通用總線功能
英文描述： 8-Bit Serial-Input/Parallel-Output Shift Register
中文描述： HC/UH SERIES, 8-BIT RIGHT SERIAL IN PARALLEL OUT SHIFT REGISTER, TRUE OUTPUT, PDIP14
封裝： PLASTIC, DIP-14
文件頁數(shù)： 6/7頁
文件大?。?/td> 204K
代理商： MC74HC164AN
MC54/74HC164
MOTOROLA
High–Speed CMOS Logic Data
DL129 — Rev 6
3–6
OUTLINE DIMENSIONS
J SUFFIX
CERAMIC DIP PACKAGE
CASE 632–08
ISSUE Y
MIN
0.750
0.245
0.155
0.015
0.055
0.100 BSC
MIN
19.05
6.23
3.94
0.39
1.40
2.54 BSC
MAX
0.785
0.280
0.200
0.020
0.065
MAX
19.94
7.11
5.08
0.50
1.65
INCHES
MILLIMETERS
DIM
A
B
C
D
F
G
J
K
L
M
N
0.015
0.170
15
°
0.040
0.008
0.125
0.300 BSC
0
°
0.020
0.38
4.31
15
°
1.01
0.21
3.18
7.62 BSC
0
°
0.51
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMESNION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
14
8
1
7
-A-
-B-
-T-
SEATING
PLANE
F
G
N
K
C
L
M
0.25 (0.010)
T
A
M
S
0.25 (0.010)
T
B
M
S
J
14 PL
D
14 PL
N SUFFIX
PLASTIC DIP PACKAGE
CASE 646–06
ISSUE L
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
1
7
14
8
B
A
F
H
G
D
K
C
N
L
J
M
SEATING
PLANE
DIM
A
B
C
D
F
G
H
J
K
L
M
N
MIN
0.715
0.240
0.145
0.015
0.040
0.100 BSC
0.052
0.008
0.115
0.300 BSC
0
0.015
MAX
0.770
0.260
0.185
0.021
0.070
MIN
18.16
6.10
3.69
0.38
1.02
MAX
19.56
6.60
4.69
0.53
1.78
MILLIMETERS
INCHES
2.54 BSC
1.32
0.20
2.92
7.62 BSC
0
0.39
0.095
0.015
0.135
2.41
0.38
3.43
10
10
1.01
0.039
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
MIN
8.55
3.80
1.35
0.35
0.40
1.27 BSC
MIN
0.337
0.150
0.054
0.014
0.016
0.050 BSC
MAX
8.75
4.00
1.75
0.49
1.25
MAX
0.344
0.157
0.068
0.019
0.049
MILLIMETERS
INCHES
DIM
A
B
C
D
F
G
J
K
M
P
R
0.19
0.10
0
°
5.80
0.25
0.25
0.25
7
°
6.20
0.50
0.008
0.004
0
°
0.228
0.010
0.009
0.009
7
°
0.244
0.019
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A–
–B–
P
7 PL
G
C
K
SEATING
PLANE
D
14 PL
M
J
R
X 45
°
1
7
8
14
0.25 (0.010)
T
B
A
M
S
S
B
0.25 (0.010)
M
M
F
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參數(shù)描述
MC74HC164ANG 功能描述:計(jì)數(shù)器移位寄存器 2-6V 8-Bit Serial In Parallel Out Shift RoHS:否 制造商:Texas Instruments 計(jì)數(shù)器類型: 計(jì)數(shù)順序:Serial to Serial/Parallel 電路數(shù)量:1 封裝 / 箱體:SOIC-20 Wide 邏輯系列: 邏輯類型: 輸入線路數(shù)量:1 輸出類型:Open Drain 傳播延遲時(shí)間:650 ns 最大工作溫度:+ 125 C 最小工作溫度:- 40 C 封裝:Reel
MC74HC164N 制造商:Motorola Inc 功能描述: 制造商:Texas Instruments 功能描述:
MC74HC165AD 功能描述:計(jì)數(shù)器移位寄存器 8bit Serial/Parallel RoHS:否 制造商:Texas Instruments 計(jì)數(shù)器類型: 計(jì)數(shù)順序:Serial to Serial/Parallel 電路數(shù)量:1 封裝 / 箱體:SOIC-20 Wide 邏輯系列: 邏輯類型: 輸入線路數(shù)量:1 輸出類型:Open Drain 傳播延遲時(shí)間:650 ns 最大工作溫度:+ 125 C 最小工作溫度:- 40 C 封裝:Reel
MC74HC165ADG 功能描述:計(jì)數(shù)器移位寄存器 8bit Serial/Parallel In Serial Out RoHS:否 制造商:Texas Instruments 計(jì)數(shù)器類型: 計(jì)數(shù)順序:Serial to Serial/Parallel 電路數(shù)量:1 封裝 / 箱體:SOIC-20 Wide 邏輯系列: 邏輯類型: 輸入線路數(shù)量:1 輸出類型:Open Drain 傳播延遲時(shí)間:650 ns 最大工作溫度:+ 125 C 最小工作溫度:- 40 C 封裝:Reel
MC74HC165ADR2 功能描述:計(jì)數(shù)器移位寄存器 8bit Serial/Parallel RoHS:否 制造商:Texas Instruments 計(jì)數(shù)器類型: 計(jì)數(shù)順序:Serial to Serial/Parallel 電路數(shù)量:1 封裝 / 箱體:SOIC-20 Wide 邏輯系列: 邏輯類型: 輸入線路數(shù)量:1 輸出類型:Open Drain 傳播延遲時(shí)間:650 ns 最大工作溫度:+ 125 C 最小工作溫度:- 40 C 封裝:Reel
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