HE A
參數(shù)資料
型號(hào): MC74AC4040DR2G
廠商: ON Semiconductor
文件頁(yè)數(shù): 6/6頁(yè)
文件大?。?/td> 0K
描述: IC COUNTER RIPPLE 12ST 16-SOIC
標(biāo)準(zhǔn)包裝: 1
系列: 74AC
邏輯類型: 二進(jìn)制計(jì)數(shù)器
方向:
元件數(shù): 1
每個(gè)元件的位元數(shù): 12
復(fù)位: 異步
計(jì)數(shù)速率: 140MHz
觸發(fā)器類型: 負(fù)邊沿
電源電壓: 2 V ~ 6 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 16-SOIC
包裝: 剪切帶 (CT)
其它名稱: MC74AC4040DR2GOSCT
MC74AC4040
http://onsemi.com
6
PACKAGE DIMENSIONS
SOEIAJ16
CASE 96601
ISSUE A
HE
A1
DIM
MIN
MAX
MIN
MAX
INCHES
2.05
0.081
MILLIMETERS
0.05
0.20
0.002
0.008
0.35
0.50
0.014
0.020
0.10
0.20
0.007
0.011
9.90
10.50
0.390
0.413
5.10
5.45
0.201
0.215
1.27 BSC
0.050 BSC
7.40
8.20
0.291
0.323
0.50
0.85
0.020
0.033
1.10
1.50
0.043
0.059
0
0.70
0.90
0.028
0.035
0.78
0.031
A1
HE
Q1
LE
_ 10_
0
_ 10_
LE
Q1
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
M
L
DETAIL P
VIEW P
c
A
b
e
M
0.13 (0.005)
0.10 (0.004)
1
16
9
8
D
Z
E
A
b
c
D
E
e
L
M
Z
ON Semiconductor and
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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