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參數(shù)資料
| 型號： | MC7457RX1333PC |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 1333 MHz, RISC PROCESSOR, CBGA483 |
| 封裝： | 29 X 29 MM, 3.22 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-483 |
| 文件頁數(shù)： | 50/73頁 |
| 文件大?。?/td> | 1715K |
| 代理商： | MC7457RX1333PC |
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MPC7457 RISC Microprocessor Hardware Specifications, Rev. 7
54
Freescale Semiconductor
System Design Information
response time necessary. They should also be connected to the power and ground planes through two vias
to minimize inductance. Suggested bulk capacitors: 100–330 F (AVX TPS tantalum or Sanyo OSCON).
9.4
Connection Recommendations
To ensure reliable operation, it is highly recommended to connect unused inputs to an appropriate signal
level. Unused active low inputs should be tied to OVDD. Unused active high inputs should be connected
to GND. All NC (no-connect) signals must remain unconnected.
Power and ground connections must be made to all external VDD, OVDD, GVDD, and GND pins in the
MPC7457. If the L3 interface is not used, GVDD should be connected to the OVDD power plane, and
L3VSEL should be connected to BVSEL; the remainder of the L3 interface may be left unterminated.
9.5
Output Buffer DC Impedance
The MPC7457 processor bus and L3 I/O drivers are characterized over process, voltage, and temperature.
To measure Z0, an external resistor is connected from the chip pad to OVDD or GND. Then, the value of
The output impedance is the average of two components, the resistances of the pull-up and pull-down
devices. When data is held low, SW2 is closed (SW1 is open), and RN is trimmed until the voltage at the
pad equals OVDD/2. RN then becomes the resistance of the pull-down devices. When data is held high,
SW1 is closed (SW2 is open), and RP is trimmed until the voltage at the pad equals OVDD/2. RP then
becomes the resistance of the pull-up devices. RP and RN are designed to be close to each other in value.
Then, Z0 = (RP + RN)/2.
Figure 25. Driver Impedance Measurement
Table 21 summarizes the signal impedance results. The impedance increases with junction temperature
and is relatively unaffected by bus voltage.
OVDD
OGND
RP
RN
Pad
Data
SW1
SW2
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| MC7457RX733NC | 功能描述:IC MPU RISC 32BIT 483FCCBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC74xx 標準包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點:- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA，F(xiàn)CBGA 供應商設備封裝:783-FCPBGA（29x29） 包裝:托盤 |
| MC7457RX867NC | 功能描述:微處理器 - MPU APOLO7 RV1.2 1.1V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MC7457TRX1000LC | 制造商:Freescale Semiconductor 功能描述:MPC74XX RISC 32-BIT 0.13UM 1GHZ 1.5V/1.8V/2.5V 483-PIN FCCBG - Trays |
| MC7457TRX1000NC | 功能描述:微處理器 - MPU APOLO7 RV1.2 1.1V -40C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MC7457TRX1267LC | 制造商:Freescale Semiconductor 功能描述:MPC74XX RISC 32-BIT 0.13UM 1.267GHZ 1.5V/1.8V/2.5V 483-PIN F - Trays |
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