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參數(shù)資料
| 型號(hào)： | MC7455ARX933LG |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 933 MHz, RISC PROCESSOR, CBGA483 |
| 封裝： | 29 X 29 MM, 1.27 MM PITCH, CERAMIC, BGA-483 |
| 文件頁數(shù)： | 53/76頁 |
| 文件大?。?/td> | 1520K |
| 代理商： | MC7455ARX933LG |
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MOTOROLA
MPC7455 RISC Microprocessor Hardware Specifications
57
System Design Information
The use of thermal grease significantly reduces the interface thermal resistance. That is, the bare joint results
in a thermal resistance approximately seven times greater than the thermal grease joint.
Often, heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board
(see Figure 25). Therefore, the synthetic grease offers the best thermal performance, considering the low
interface pressure and is recommended due to the high power dissipation of the MPC7455. Of course, the
selection of any thermal interface material depends on many factors—thermal performance requirements,
manufacturability, service temperature, dielectric properties, cost, etc.
Figure 29. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interface. Heat sink adhesive materials
should be selected based on high conductivity, yet adequate mechanical strength to meet equipment
shock/vibration requirements. There are several commercially available thermal interfaces and adhesive
materials provided by the following vendors:
The Bergquist Company
800-347-4572
18930 West 78th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
Chomerics, Inc.
781-935-4850
77 Dragon Ct.
Woburn, MA 01888-4014
Internet: www.chomerics.com
0
0.5
1
1.5
2
0
1020
30
4050
6070
80
Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
Contact Pressure (psi)
Spe
c
if
ic
The
rma
lR
e
sis
ta
n
c
e
(K-i
n.
2
/W)
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