參數(shù)資料
型號: MC7448HX1420LD
廠商: Freescale Semiconductor
文件頁數(shù): 5/60頁
文件大?。?/td> 0K
描述: IC MPU RISC 32BIT 360-FCCBGA
標(biāo)準(zhǔn)包裝: 1
系列: MPC74xx
處理器類型: 32-位 MPC74xx PowerPC
速度: 1.42GHz
電壓: 1.2V
安裝類型: 表面貼裝
封裝/外殼: 360-BCBGA,F(xiàn)CCBGA
供應(yīng)商設(shè)備封裝: 360-FCCBGA(25x25)
包裝: 托盤
MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4
Freescale Semiconductor
13
Electrical and Thermal Characteristics
Table 7 provides the power consumption for the MPC7448 part numbers described by this document; see
numbers are described by this document. Freescale also offers MPC7448 part numbers that meet lower
power consumption specifications by adhering to lower core voltage and core frequency specifications.
For more information on these devices, including references to the MPC7448 Hardware Specification
Addenda that describe these devices, see Section 11.2, “Part Numbers Not Fully Addressed by This
The power consumptions provided in Table 7 represent the power consumption of each speed grade when
operated at the rated maximum core frequency (see Table 8). Freescale sorts devices by power as well as
by core frequency, and power limits for each speed grade are independent of each other. Each device is
tested at its maximum core frequency only. (Note that Deep Sleep Mode power consumption is
independent of clock frequency.) Operating a device at a frequency lower than its rated maximum is fully
supported provided the clock frequencies are within the specifications given in Table 8, and a device
operated below its rated maximum will have lower power consumption. However, inferences should not
be made about a device’s power consumption based on the power specifications of another (lower) speed
grade. For example, a 1700 MHz device operated at 1420 MHz may not exhibit the same power
consumption as a 1420 MHz device operated at 1420 MHz.
For all MPC7448 devices, the following guidelines on the use of these parameters for system design are
suggested. The Full-Power Mode–Typical value represents the sustained power consumption of the device
High-impedance (off-state) leakage current:
Vin = OVDD
Vin = GND
—ITSI
50
– 50
A
2, 3, 4
Output high voltage @ IOH = –5 mA
1.5
VOH
OVDD – 0.45
V
1.8
OVDD – 0.45
2.5
1.8
Output low voltage @ IOL = 5 mA
1.5
VOL
—0.45
V
1.8
0.45
2.5
0.6
Capacitance,
Vin = 0 V, f = 1 MHz
All inputs
Cin
—8.0
pF
5
Notes:
1. Nominal voltages; see Table 4 for recommended operating conditions.
2. All I/O signals are referenced to OVDD.
3. Excludes test signals and IEEE Std. 1149.1 boundary scan (JTAG) signals
4. The leakage is measured for nominal OVDD and VDD, or both OVDD and VDD must vary in the same direction (for
example, both OVDD and VDD vary by either +5% or –5%).
5. Capacitance is periodically sampled rather than 100% tested.
6. These pins have internal pull-up resistors.
Table 6. DC Electrical Specifications (continued)
At recommended operating conditions. See Table 4.
Characteristic
Nominal Bus
Voltage 1
Symbol
Min
Max
Unit
Notes
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