參數(shù)資料
型號(hào): MC7447AHX600NB
廠商: Freescale Semiconductor
文件頁數(shù): 41/56頁
文件大?。?/td> 0K
描述: IC MPU RISC 600MHZ 360-FCCBGA
標(biāo)準(zhǔn)包裝: 44
系列: MPC74xx
處理器類型: 32-位 MPC74xx PowerPC
速度: 600MHz
電壓: 1.1V
安裝類型: 表面貼裝
封裝/外殼: 360-BCBGA,F(xiàn)CCBGA
供應(yīng)商設(shè)備封裝: 360-FCCBGA(25x25)
包裝: 托盤
MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5
46
Freescale Semiconductor
System Design Information
the selection of any thermal interface material depends on many factors—thermal performance
requirements, manufacturability, service temperature, dielectric properties, cost, and so on.
Figure 23. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interface. Heat sink adhesive materials
should be selected based on high conductivity and mechanical strength to meet equipment shock/vibration
requirements. There are several commercially available thermal interfaces and adhesive materials
provided by the following vendors:
The Bergquist Company
800-347-4572
18930 West 78th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
Chomerics, Inc.
781-935-4850
77 Dragon Ct.
Woburn, MA 01801
Internet: www.chomerics.com
Dow-Corning Corporation
800-248-2481
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dowcorning.com
0
0.5
1
1.5
2
0
1020
30
40
50607080
Silicone Sheet (0.006 in.)
Bare Joint
Fluoroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
Contact Pressure (psi)
Spec
if
ic
Ther
m
a
lResi
st
ance
(K
-i
n.
2
/W
)
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