
52-Pin Windowed Ceramic-Leaded Chip Carrier (Case 778B)
M68HC11E Family Data Sheet, Rev. 5.1
Freescale Semiconductor
183
11.6 52-Pin Windowed Ceramic-Leaded Chip Carrier (Case 778B)
0.15 (0.006)
-T-
SEATING
PLANE
M
0.51 (0.020)
A S
T
S
B
G
C
K
H
-B-
NOTES:
1.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2.
CONTROLLING DIMENSION: INCH.
3.
DIMENSION R AND N DO NOT INCLUDE
GLASS PROTRUSION. GLASS PROTRUSION
TO BE 0.25 (0.010) MAXIMUM.
4.
ALL DIMENSIONS AND TOLERANCES
INCLUDE LEAD TRIM OFFSET AND LEAD
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.785
0.795
19.94
20.19
B
0.785
0.795
19.94
20.19
C
0.165
0.200
4.20
5.08
D
0.017
0.021
0.44
0.53
F
0.026
0.032
0.67
0.81
G
0.050 BSC
1.27 BSC
H
0.090
0.130
2.29
3.30
J
0.006
0.010
0.16
0.25
K
0.035
0.045
0.89
1.14
N
0.735
0.756
18.67
19.20
R
0.735
0.756
18.67
19.20
S
0.690
0.730
17.53
18.54
N
R
-A-
M
0.51 (0.020)
A S
T
S
B
S
F
J
M
0.18 (0.007)
A S
T
S
B
D 52 PL