參數(shù)資料
型號: MC68HC705K1P
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: 8-BIT, OTPROM, 2 MHz, MICROCONTROLLER, PDIP16
封裝: PLASTIC, DIP-16
文件頁數(shù): 23/140頁
文件大?。?/td> 1219K
代理商: MC68HC705K1P
Electrical Specifications
Thermal Characteristics
MC68HC705K1 — Rev. 2.0
Technical Data
MOTOROLA
Electrical Specifications
119
12.5 Thermal Characteristics
12.6 Power Considerations
The average chip junction temperature, TJ, in °C can be obtained from:
TJ = TA + (PD x θJA)
(1)
Where:
TA = ambient temperature in °C
θ
JA = package thermal resistance, junction to ambient in °C/W
PD = PINT + PI/O
PINT = ICC × VCC = chip internal power dissipation
PI/O = power dissipation on input and output pins (user-determined)
For most applications, PI/O < PINT and can be neglected.
Ignoring PI/O, the relationship between PD and TJ is approximately:
(2)
Solving equations (1) and (2) for K gives:
= PD x (TA + 273°C) + θJA x (PD)
2
(3)
where K is a constant pertaining to the particular part. K can be
determined from equation (3) by measuring PD (at equilibrium) for a
known TA. Using this value of K, the values of PD and TJ can be obtained
by solving equations (1) and (2) iteratively for any value of TA.
Characteristic
Symbol
Value
Unit
Maximum junction temperature
TJ
150
°C
Thermal resistance
MC68HC705K1P(1)
MC68HC705K1DW(2)
1. P = Plastic dual in-line package (PDIP)
2. DW = Small outline integrated circuit (SOIC)
θ
JA
100
140
°C/W
PD =
TJ + 273°C
K
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