
Data Sheet
MC68HC08AS32A — Rev. 1.1
292
Freescale Semiconductor
19.3 52-Pin Plastic Leaded Chip Carrier Package (Case 778)
–L–
Y BRK
W
D
V
52
1
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE
TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT
MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE MEASURED
AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING
ANY MISMATCH BETWEEN THE TOP AND BOTTOM
OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE
H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
B
U
Z
G1
X
VIEW D–D
H
K1
K
F
VIEW S
M
0.007 (0.18)
L–M S
T
S
N
M
0.007 (0.18)
L–M S
T
S
N
0.004 (0.100)
–T– SEATING
PLANE
M
0.007 (0.18)
L–M S
T
S
N
M
0.007 (0.18)
L–M S
T
S
N
A
R
G
G1
C
Z
J
E
VIEW S
–M–
–N–
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.785
0.795
19.94
20.19
B
0.785
0.795
19.94
20.19
C
0.165
0.180
4.20
4.57
E
0.090
0.110
2.29
2.79
F
0.013
0.019
0.33
0.48
G
0.050 BSC
1.27 BSC
H
0.026
0.032
0.66
0.81
J
0.020
–––
0.51
–––
K
0.025
–––
0.64
–––
R
0.750
0.756
19.05
19.20
U
0.750
0.756
19.05
19.20
V
0.042
0.048
1.07
1.21
W
0.042
0.048
1.07
1.21
X
0.042
0.056
1.07
1.42
Y
–––
0.020
–––
0.50
Z
2
10
2
10
G1
0.710
0.730
18.04
18.54
K1
0.040
–––
1.02
–––
__
M
0.007 (0.18)
L–M S
T
S
N
M
0.007 (0.18)
L–M S
T
S
N
S
0.010 (0.25)
L–M S
T
S
N
S
0.010 (0.25)
L–M S
T
S
N