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參數(shù)資料
| 型號(hào)： | MC68HC08AS20VFNR2 |
| 廠(chǎng)商： | MOTOROLA INC |
| 元件分類(lèi)： | 微控制器/微處理器 |
| 英文描述： | 8-BIT, MROM, MICROCONTROLLER, PQCC52 |
| 封裝： | PLASTIC, LCC-52 |
| 文件頁(yè)數(shù)： | 76/96頁(yè) |
| 文件大?。?/td> | 3243K |
| 代理商： | MC68HC08AS20VFNR2 |
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9
MOTOROLA
9-2
MC68HC05E0
ELECTRICAL SPECIFICATIONS
9.3
Thermal Characteristics and Power Considerations
The average chip junction temperature, TJ, in degrees Celsius can be obtained from the following
equation:
TJ= TA + (PD θJA)
Where:
TA
=
Ambient Temperature (οC)
θJA
=
Package Thermal Resistance, Junction-to-Ambient (οC/W)
PD
=
PINT + PI/O
PINT =
IDD x VDD (W) = Internal Chip Power
PI/O =
Power Dissipation on Input and Output Pins (User Determined)
Note:
For most applications PI/O < PINT and can be neglected.
An approximate relationship between PD and TJ (if PI/O is neglected) is:
PD= K ÷ (TJ + 273οC)
Solving the equations PD and TJ for K gives:
K = PD (TA+ 273οC) + θJA PD2
Where K is a constant pertaining to a particular part. K can be determined by measuring PD (at
equilibrium) for known TA. Using this value of K the values of PD and TJ can be obtained by solving
the above equations for any value of TA.The package thermal characteristics are shown in Table 9-2.
Table 9-2 Thermal Characteristics
Figure 9-1 Equivalent Test Load
Characteristics
Symbol
Value
Unit
Thermal Resistance
Plastic 68-Pin Quad Pack (PLCC)
θJA
50
°C/W
Pins
R1
R2
C
A12
A0,
PD7
PD5,
CSROM, R/W,
CS2, CS3
3.26 k
2.38 k
50 pF
R2
C
Test
Point
78
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