參數(shù)資料
型號: MC33689DDWB
廠商: Freescale Semiconductor
文件頁數(shù): 27/31頁
文件大?。?/td> 0K
描述: IC SYSTEM BASE W/LIN 32-SOIC
標準包裝: 42
應用: 自動鏡像控制
接口: SPI
電源電壓: 5.5 V ~ 18 V
封裝/外殼: 32-SOIC(0.295",7.50mm 寬)
供應商設(shè)備封裝: 32-SOIC
包裝: 管件
安裝類型: 表面貼裝
配用: KIT33689DWBEVB-ND - KIT FOR 33689 SBC WITH LIN
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
33689
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
VPWR Supply Voltage at VS1 and VS2
Continuous
Transient (Load Dump)
VSUPDC
VSUPTR
-0.3 to 27
40
V
Supply Voltage at VDD and VCC
VDD
-0.3 to 5.5
V
Output Current at VDD
IDD
Internally Limited
A
Logic Input Voltage at MOSI, SCLK, CS, IN, and TXD
VINLOG
-0.3 to VDD+0.3
V
Logic Output Voltage at MISO, INT, RST, and RXD
VOUTLOG
-0.3 to VDD+0.3
V
Input Voltage at E+ and E
-
VE+/VE-
-0.3 to 7.0
V
Input Current at E+ and E
-
IE+/IE-
±20
mA
Output Voltage at OUT
VOUT
-0.3 to VCC+0.33
V
Output Current at OUT
IOUT
±20
mA
Input Voltage at L1 and L2
DC Input with a 33 k
Ω Resistor
Transient Input with External Component (per ISO7637 Specification) (See
VLXDC
VLXTR
-18 to 40
±100
V
Input/Output Voltage at LIN
DC Voltage
Transient Input Voltage with specified External Component (per ISO7637
Specification) (See Figure 4, page 6)
VBUSDC
VBUSTR
-18 to 40
-150 to 100
V
DC Output Voltage at HS1 and HS2
Positive
Negative
VHS+
VHS-
VVS2 + 0.3
Internally Clamped
V
DC Output Voltage at HS3
VHS3
-0.3 to VVS2 + 0.3
V
ESD Voltage, Human Body Model (1)
GND Configured as Ground. TGND and AGND Configured as I/O Pins
LIN, L1, and L2
All Other Pins
VESD1
±4000
±2000
V
ESD Voltage, Charge Device Model (1)
Corner Pins (Pins 1, 16, 17, and 32)
All other Pins (Pins 2–15 and 18–31)
VESD2
±750
±500
V
Notes
1.
ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), ESD2 testing is performed in
accordance with the Charge Device Model, Robotic (CZAP =4.0 pF).
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