參數(shù)資料
型號(hào): MC33064DM-5R2G
廠商: ON SEMICONDUCTOR
元件分類: 電源管理
英文描述: UNDERVOLTAGE SENSING CIRCUIT
中文描述: 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO8
封裝: LEAD FREE, PLASTIC, MICROPAK-8
文件頁(yè)數(shù): 6/8頁(yè)
文件大?。?/td> 143K
代理商: MC33064DM-5R2G
MC34064 MC33064
6
MOTOROLA ANALOG IC DEVICE DATA
P SUFFIX
PLASTIC PACKAGE
CASE 29–04
(TO–226AA)
ISSUE AD
D SUFFIX
PLASTIC PACKAGE
CASE 751–05
(SO–8)
ISSUE P
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. DIMENSION F APPLIES BETWEEN P AND L.
DIMENSION D AND J APPLY BETWEEN L AND K
MINIMUM. LEAD DIMENSION IS UNCONTROLLED
IN P AND BEYOND DIMENSION K MINIMUM.
R
A
P
J
L
F
B
K
G
H
V
SECTION X–X
C
D
N
N
X X
SEATING
PLANE
DIM
A
B
C
D
F
G
H
J
K
L
N
P
R
V
MIN
0.175
0.170
0.125
0.016
0.016
0.045
0.095
0.015
0.500
0.250
0.080
–––
0.115
0.135
MAX
0.205
0.210
0.165
0.022
0.019
0.055
0.105
0.020
–––
–––
0.105
0.100
–––
–––
MIN
4.45
4.32
3.18
0.41
0.41
1.15
2.42
0.39
12.70
6.35
2.04
–––
2.93
3.43
MAX
5.20
5.33
4.19
0.55
0.48
1.39
2.66
0.50
–––
–––
2.66
2.54
–––
–––
MILLIMETERS
INCHES
1
SEATING
PLANE
1
4
5
8
C
K
4
A
0.25 (0.010)
M
T B
S
S
0
B
M
8X
D
R
M
J
X
F
–A–
–B–
–T–
DIM
A
B
C
D
F
G
J
K
M
P
R
MIN
4.80
3.80
1.35
0.35
0.40
1.27 BSC
0.18
0.10
0
5.80
0.25
MAX
5.00
4.00
1.75
0.49
1.25
MILLIMETERS
0.25
0.25
7
6.20
0.50
G
NOTES:
1. DIMENSIONS A AND B ARE DATUMS AND T IS A
DATUM SURFACE.
2. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
3. DIMENSIONS ARE IN MILLIMETER.
4. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
5. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
6. DIMENSION D DOES NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE D DIMENSION AT MAXIMUM MATERIAL
CONDITION.
OUTLINE DIMENSIONS
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