參數資料
型號: MC3302PG
廠商: ON Semiconductor
文件頁數: 11/11頁
文件大?。?/td> 0K
描述: IC COMP QUAD SINGLE SUPPLY 14DIP
標準包裝: 500
類型: 通用
元件數: 4
輸出類型: CMOS,開路集電極,TTL
電壓 - 電源,單路/雙路(±): 3 V ~ 30 V,±1.5 V ~ 15 V
電壓 - 輸入偏移(最小值): 20mV @ 5V
電流 - 輸入偏壓(最小值): 0.5µA @ 5V
電流 - 輸出(標準): 16mA @ 5V
電流 - 靜態(tài)(最大值): 2.5mA
工作溫度: -40°C ~ 85°C
封裝/外殼: 14-DIP(0.300",7.62mm)
安裝類型: 通孔
包裝: 管件
產品目錄頁面: 1130 (CN2011-ZH PDF)
其它名稱: MC3302PGOS
LM339, LM239, LM2901, LM2901V, NCV2901, MC3302
http://onsemi.com
9
PACKAGE DIMENSIONS
PDIP14
CASE 64606
ISSUE R
17
14
8
b2
NOTE 8
D
A
TOP VIEW
E1
B
b
L
A1
A
C
SEATING
PLANE
0.010
CA
SIDE VIEW
M
14X
D1
e
A2
NOTE 3
M
B M
eB
E
END VIEW
WITH LEADS CONSTRAINED
DIM
MIN
MAX
INCHES
A
0.210
A1
0.015
b
0.014
0.022
C
0.008
0.014
D
0.735
0.775
D1
0.005
e
0.100 BSC
E
0.300
0.325
M
10
5.33
0.38
0.35
0.56
0.20
0.36
18.67
19.69
0.13
2.54 BSC
7.62
8.26
10
MIN
MAX
MILLIMETERS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-
AGE SEATED IN JEDEC SEATING PLANE GAUGE GS3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE
NOT TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION E3 IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
E1
0.240
0.280
6.10
7.11
b2
eB
0.430
10.92
0.060 TYP
1.52 TYP
c
A2
0.115
0.195
2.92
4.95
L
0.115
0.150
2.92
3.81
°
H
NOTE 5
NOTE 6
M
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