MOTOROLA CMOS LOGIC DATA
7
MC14544B/D
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 726–04
ISSUE G
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F FOR FULL LEADS. HALF
LEADS OPTIONAL AT LEAD POSITIONS 1, 9,
10, AND 18.
1
SEATING
10
9
18
M
K
C
N
F
G
D
L
–A–
–B–
18 PL
0.25 (0.010)
J
18 PL
0.25 (0.010)
–T–
S
A
M
T
S
B
M
T
CONFIOPTIONAL LEAD
DIM
A
B
C
D
F
MIN
0.880
0.240
–––
0.015
0.055
MAX
0.910
0.295
0.200
0.021
0.070
MIN
22.35
6.10
–––
0.38
1.40
MAX
23.11
7.49
5.08
0.53
1.78
MILLIMETERS
INCHES
G
J
K
L
M
N
2.54 BSC
0.20
3.18
7.62 BSC
0
0.51
0.100 BSC
0.008
0.125
0.300 BSC
0
0.020
0.30
4.32
0.012
0.170
15
1.02
15
0.040
P SUFFIX
PLASTIC DIP PACKAGE
CASE 707–02
ISSUE C
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO
SEATING PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
1
SEATING
10
9
18
M
A
B
K
C
N
F
G
D
H
J
L
DIM
A
B
C
D
F
G
H
J
K
L
M
N
MIN
22.22
6.10
3.56
0.36
1.27
MAX
23.24
6.60
4.57
0.56
1.78
MIN
0.875
0.240
0.140
0.014
0.050
0.100 BSC
0.040
0.008
0.115
0.300 BSC
0
0.020
MAX
0.915
0.260
0.180
0.022
0.070
INCHES
MILLIMETERS
2.54 BSC
1.02
0.20
2.92
7.62 BSC
0
0.51
1.52
0.30
3.43
0.060
0.012
0.135
15
1.02
15
0.040
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