參數(shù)資料
型號: MC145444
廠商: Motorola, Inc.
英文描述: Single-Chip 300-Baud Modem
中文描述: 單芯片300波特調(diào)制解調(diào)器
文件頁數(shù): 11/12頁
文件大小: 161K
代理商: MC145444
MC145444
MOTOROLA
11
PACKAGE DIMENSIONS
H SUFFIX
PLASTIC DIP
CASE 804–01
0.030 NOM
0.009
0.115
0.300 BSC
0
0.020
0.76 NOM
0.23
2.93
7.62 BSC
0
0.51
B
N
K
C
L
M
J
H
G
F
NOTES:
1.
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2.
DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
3.
DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4.
CONTROLLING DIMENSION: INCH.
DIM
A
B
C
D
F
G
H
J
K
L
M
N
MIN
0.930
0.240
0.150
0.015
0.050
0.100 BSC
MAX
0.970
0.260
0.170
0.022
0.070
MIN
23.63
6.10
3.81
0.38
1.27
MAX
24.63
6.60
4.31
0.56
1.78
MILLIMETERS
INCHES
2.54 BSC
0.013
0.140
0.33
3.55
15
15
1.02
0.040
SEATING
20
1
11
10
–A–
D
20 PL
0.25 (0.010)
–T–
M
A
M
T
DW SUFFIX
SOG PACKAGE
CASE 751D–04
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
–A–
–B–
20
1
11
10
S
A
M
0.010 (0.25)
B
S
T
D
20X
M
B
M
0.010 (0.25)
P
10X
J
F
G
18X
K
C
–T–
SEATING
PLANE
M
R
X 45
DIM
A
B
C
D
F
G
J
K
M
P
R
MIN
12.65
7.40
2.35
0.35
0.50
MAX
12.95
7.60
2.65
0.49
0.90
MIN
0.499
0.292
0.093
0.014
0.020
0.050 BSC
0.010
0.004
0
0.395
0.010
MAX
0.510
0.299
0.104
0.019
0.035
INCHES
MILLIMETERS
1.27 BSC
0.25
0.10
0
10.05
0.25
0.32
0.25
7
10.55
0.75
0.012
0.009
7
0.415
0.029
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MC145447P 制造商:Motorola Inc 功能描述:
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