參數(shù)資料
型號(hào): MC145443BDW
廠商: MOTOROLA INC
元件分類: 調(diào)制器/解調(diào)器
英文描述: Single-Chip 300-Baud Modem
中文描述: 0.3 kbps DATA, MODEM, PDSO20
封裝: SOG-20
文件頁(yè)數(shù): 11/12頁(yè)
文件大小: 111K
代理商: MC145443BDW
MC145442B
MC145443B
MOTOROLA
11
PACKAGE DIMENSIONS
P SUFFIX
PLASTIC DIP
CASE 738–03
1.070
0.260
0.180
0.022
0.070
0.015
0.140
15
°
0.040
1.010
0.240
0.150
0.015
0.050 BSC
0.050
0.100 BSC
0.008
0.110
0.300 BSC
0
°
0.020
25.66
6.10
3.81
0.39
1.27 BSC
1.27
2.54 BSC
0.21
2.80
7.62 BSC
0
°
0.51
27.17
6.60
4.57
0.55
1.77
0.38
3.55
15
°
1.01
MIN
MIN
MAX
MAX
INCHES
MILLIMETERS
DIM
A
B
C
D
E
F
G
J
K
L
M
N
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
-A-
C
K
N
E
G
F
D
20 PL
J
20 PL
L
M
-T-
SEATING
PLANE
1
10
11
20
0.25 (0.010)
T
A
M
M
0.25 (0.010)
T
B
M
M
B
DW SUFFIX
SOG PACKAGE
CASE 751D–05
20
1
11
10
B
0.25
20X
H
1
C
L
18X
A1
A
SEATING
h
E
D
M
0
M
B
M
S
A
S
B
T
e
T
B
A
DIM
A
A1
B
C
D
E
e
H
h
L
MIN
2.35
0.10
0.35
0.23
12.65
7.40
MAX
2.65
0.25
0.49
0.32
12.95
7.60
MILLIMETERS
1.27 BSC
10.05
0.25
0.50
0
10.55
0.75
0.90
7
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUMMOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT
MAXIMUMMATERIAL CONDITION.
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