MC13109
27
MOTOROLA ANALOG IC DEVICE DATA
FB SUFFIX
PLASTIC PACKAGE
CASE 848B–04
(QFP–52)
ISSUE C
OUTLINE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF LEAD AND IS
COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE
PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE.
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT DATUM
PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING
PLANE –C–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 (0.010) PER
SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH
AND ARE DETERMINED AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON
THE LOWER RADIUS OR THE FOOT.
DETAIL A
L
39
40
26
27
1
52
14
13
L
–A–
B
V
S
A–B
M
0.20 (0.008)
0.05 (0.002)
D
S
H
A–B
S
A–B
M
0.20 (0.008)
D
S
C
–D–
B
V
–B–
S
A
M
0
D
H
A
0
S
A
M
0
D
C
–H–
0.10 (0.004)
SEATING
–C–
DATUM
PLANE
M
G
H
E
C
M
DETAIL C
U
Q
X
W
K
T
R
DETAIL C
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
Q
R
S
T
U
V
W
X
MIN
9.90
9.90
2.10
0.22
2.00
0.22
0.65 BSC
–––
0.13
0.65
7.80 REF
5
0.13
0
0.13
12.95
0.13
0
12.95
0.35
1.6 REF
MAX
10.10
10.10
2.45
0.38
2.10
0.33
MIN
0.390
0.390
0.083
0.009
0.079
0.009
0.026 BSC
–––
0.005
0.026
0.307 REF
5
0.005
0
0.005
0.510
0.005
0
0.510
0.014
0.063 REF
MAX
0.398
0.398
0.096
0.015
0.083
0.013
INCHES
MILLIMETERS
0.25
0.23
0.95
0.010
0.009
0.037
10
0.17
7
0.30
13.45
–––
–––
13.45
0.45
10
0.007
7
0.012
0.530
–––
–––
0.530
0.018
B
B
DETAIL A
–A–, –B–, –D–
J
N
D
F
BASE METAL
SECTION B–B
S
A–B
M
0.02 (0.008)
D
S
C
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