MC10EP52, MC100EP52
http://onsemi.com
2
Figure 1. 8Lead Pinout (Top View) and Logic Diagram
1
2
3
45
6
7
8
Q
VEE
VCC
D
Q
CLK
D
Flip-Flop
PIN
CLK*, CLK*
FUNCTION
ECL Clock Inputs
D*, D*
ECL Data Input
Q, Q
ECL Data Outputs
VCC
Positive Supply
VEE
Negative Supply
* Pins will default LOW when left open.
Table 1. PIN DESCRIPTION
D
L
H
CLK
Z
Q
L
H
Z = LOW to HIGH Transition
Table 2. TRUTH TABLE
EP
(DFN8 only) Thermal exposed pad
must be connected to a sufficient
thermal conduit. Electrically connect to
the most negative supply (GND) or
leave unconnected, floating open.
Table 3. ATTRIBUTES
Characteristics
Value
Internal Input Pulldown Resistor
75 kW
Internal Input Pullup Resistor
N/A
ESD Protection
Human Body Model
Machine Model
Charged Device Model
> 4 kV
> 200 V
> 2 kV
Moisture Sensitivity, Indefinite Time Out of Drypack (Note
1)Pb Pkg
PbFree Pkg
SOIC8
TSSOP8
DFN8
Level 1
Level 3
Level 1
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V0 @ 0.125 in
Transistor Count
155 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.