參數(shù)資料
型號: MC100EL05DTR2G
廠商: ON Semiconductor
文件頁數(shù): 2/9頁
文件大小: 0K
描述: IC GATE AND/NAND ECL 2INP 8TSSOP
標準包裝: 2,500
系列: 100EL
邏輯類型: 與/與非門
電路數(shù): 1
輸入數(shù): 4 輸入(2,2)
施密特觸發(fā)器輸入:
輸出類型: 差分
電源電壓: 4.2 V ~ 5.7 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 8-TSSOP,8-MSOP(0.118",3.00mm 寬)
供應商設備封裝: 8-TSSOP
包裝: 帶卷 (TR)
MC10EL05, MC100EL05
http://onsemi.com
2
Table 1. TRUTH TABLE
D0
D1
D0
D1
Q
L
H
L
H
L
H
L
H
L
H
L
H
L
H
L
Table 1. PIN DESCRIPTION
PIN
Function
D0, D0; D1, D1
ECL Data Inputs
Q, Q
ECL Data Outputs
VCC
Positive Supply
VEE
Negative Supply
EP
(DFN8 only) Thermal exposed pad
must be connected to a sufficient
thermal conduit. Electrically connect to
the most negative supply (GND) or
leave unconnected, floating open.
Table 2. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
PECL Mode Power Supply
VEE = 0 V
8
V
VEE
NECL Mode Power Supply
VCC = 0 V
8
V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
VI VCC
VI VEE
6
V
Iout
Output Current
Continuous
Surge
50
100
mA
TA
Operating Temperature Range
40 to +85
°C
Tstg
Storage Temperature Range
65 to +150
°C
qJA
Thermal Resistance (JunctiontoAmbient)
0 lfpm
500 lfpm
SOIC8
190
130
°C/W
qJC
Thermal Resistance (JunctiontoCase)
Standard Board
SOIC8
41 to 44
°C/W
qJA
Thermal Resistance (JunctiontoAmbient)
0 lfpm
500 lfpm
TSSOP8
185
140
°C/W
qJC
Thermal Resistance (JunctiontoCase)
Standard Board
TSSOP8
41 to 44 ± 5%
°C/W
qJA
Thermal Resistance (JunctiontoAmbient)
0 lfpm
500 lfpm
DFN8
129
84
°C/W
Tsol
Wave Solder
Pb
PbFree
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
265
°C
qJC
Thermal Resistance (JunctiontoCase)
(Note 1)
DFN8
35 to 40
°C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. JEDEC standard multilayer board 2S2P (2 signal, 2 power)
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