- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄371000 > MBD330DWT1 (MOTOROLA INC) Dual Schottky Barrier Diodes PDF資料下載
參數(shù)資料
| 型號(hào)： | MBD330DWT1 |
| 廠商： | MOTOROLA INC |
| 元件分類： | 參考電壓二極管 |
| 英文描述： | Dual Schottky Barrier Diodes |
| 中文描述： | SILICON, VHF-UHF BAND, MIXER DIODE |
| 文件頁數(shù)： | 6/8頁 |
| 文件大?。?/td> | 180K |
| 代理商： | MBD330DWT1 |
6
Motorola Small–Signal Transistors, FETs and Diodes Device Data
INFORMATION FOR USING THE SOT–363 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to insure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
SOT–363
éé
éé
éé
éé
éé
éé
éé
éé
0.5 mm (min)
éé
éé
éé
éé
éé
éé
éé
éé
éé
éé
éé
éé
0
0
1.9 mm
SOT–363 POWER DISSIPATION
The power dissipation of the SOT–363 is a function of the
pad size. This can vary from the minimum pad size for
soldering to a pad size given for maximum power dissipation.
Power dissipation for a surface mount device is determined
by TJ(max), the maximum rated junction temperature of the
die, R
θ
JA, the thermal resistance from the device junction to
ambient, and the operating temperature, TA. Using the
values provided on the data sheet for the SOT–363 package,
PD can be calculated as follows:
PD =
TJ(max) – TA
R
θ
JA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature TA of 25
°
C, one can
calculate the power dissipation of the device which in this
case is 120 milliwatts.
PD =
125
°
C – 25
°
C
833
°
C/W
= 120 milliwatts
The 833
°
C/W for the SOT–363 package assumes the use
of the recommended footprint on a glass epoxy printed circuit
board to achieve a power dissipation of 120 milliwatts. There
are other alternatives to achieving higher power dissipation
from the SOT–363 package. Another alternative would be to
use a ceramic substrate or an aluminum core board such as
Thermal Clad
. Using a board material such as Thermal
Clad, an aluminum core board, the power dissipation can be
doubled using the same footprint.
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
Always preheat the device.
The delta temperature between the preheat and
soldering should be 100
°
C or less.*
When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference shall be a maximum of 10
°
C.
The soldering temperature and time shall not exceed
260
°
C for more than 10 seconds.
When shifting from preheating to soldering, the
maximum temperature gradient shall be 5
°
C or less.
After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.
Mechanical stress or shock should not be applied during
cooling.
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MBD110DWT1 | Dual SCHOTTKY Barrier Diodes |
| MBD770DWT1 | Dual SCHOTTKY Barrier Diodes |
| MBR2515L | SWITCHMODE⑩ Power Rectifier |
| MBR4015LWT | SWITCHMODE⑩ Power Rectifier |
| MBR4015 | SWITCHMODE⑩ Power Rectifier |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MBD330DWT1G | 功能描述:肖特基二極管與整流器 30V 120mW Dual Isolated RoHS:否 制造商:Skyworks Solutions, Inc. 產(chǎn)品:Schottky Diodes 峰值反向電壓:2 V 正向連續(xù)電流:50 mA 最大浪涌電流: 配置:Crossover Quad 恢復(fù)時(shí)間: 正向電壓下降:370 mV 最大反向漏泄電流: 最大功率耗散:75 mW 工作溫度范圍:- 65 C to + 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOT-143 封裝:Reel |
| MBD-333-AL | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Low TCR, 1mW Dual Rejustor⑩ Micro-Resistor |
| MBD37846301 | 制造商:LG Corporation 功能描述:Bumper,Head |
| MBD38460401 | 制造商:LG Corporation 功能描述:Bumper,Roller |
| MBD4148W | 制造商:FCI 制造商全稱:First Components International 功能描述:200mW Surface Mount Zener Diode SWITCHING DIODE Collector current 150 mA |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。