參數(shù)資料
型號: MB9BF617TBGL
廠商: FUJITSU LTD
元件分類: 微控制器/微處理器
英文描述: 32-BIT, FLASH, RISC MICROCONTROLLER, PBGA192
封裝: 12 X 12 MM, 1.45 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, PLASTIC, FBGA-192
文件頁數(shù): 32/132頁
文件大?。?/td> 1257K
代理商: MB9BF617TBGL
127
FUJITSU SEMICONDUCTOR CONFIDENTIAL
r1.0
DS706-00014-0v01-E
MB9B610T Series
144-pin plastic LQFP
Lead pitch
0.50 mm
Package width
×
package length
20.0
× 20.0 mm
Lead shape
Gullwing
Sealing method
Plastic mold
Mounting height
1.70 mm MAX
Weight
1.20 g
Code
(Reference)
P-LFQFP144-20
×20-0.50
144-pin plastic LQFP
(FPT-144P-M08)
C
2003-2010 FUJITSU SEMICONDUCTOR LIMITED F144019S-c-4-8
Details of "A" part
0.25(.010)
(Stand off)
(.004±.004)
0.10±0.10
(.024±.006)
0.60±0.15
(.020±.008)
0.50±0.20
1.50
+0.20
–0.10
+.008
–.004
.059
0°~8°
0.50(.020)
"A"
0.08(.003)
0.145±0.055
(.006±.002)
LEAD No. 1
36
INDEX
37
72
73
108
109
144
0.22±0.05
(.009±.002)
M
0.08(.003)
22.00±0.20(.866±.008)SQ
(Mounting height)
* 20.00±0.10(.787±.004)SQ
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
Note 1)
*:Values do not include resin protrusion.
Resin protrusion is +0.25(.010)Max(each side).
Note 2) Pins width and pins thickness include plating thickness.
Note 3) Pins width do not include tie bar cutting remainder.
Please check the latest package dimension at the following URL.
http://edevice.fujitsu.com/package/en-search/
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