參數(shù)資料
型號(hào)： MB91F668PMC
廠商： FUJITSU LTD
元件分類(lèi)： 微控制器/微處理器
英文描述： 32-BIT, FLASH, 33 MHz, RISC MICROCONTROLLER, PQFP48
封裝： 7 X 7 MM, 1.70 MM HEIGHT, 0.50 MM PITCH, PLASTIC, LQFP-48
文件頁(yè)數(shù)： 20/104頁(yè)
文件大?。?/td> 3106K
代理商： MB91F668PMC
MB91665 Series
22
DS07-16916-2E
Latch-up
Semiconductor devices are constructed by the formation of P-type and N-type areas on a substrate. When
subjected to abnormally high voltages, internal parasitic PNPN junctions (called thyristor structures) may be
formed, causing large current levels in excess of several hundred mA to flow continuously at the power supply
pin. This condition is called latch-up.
CAUTION: The occurrence of latch-up not only causes loss of reliability in the semiconductor device, but can
cause injury or damage from high heat, smoke or flame. To prevent this from happening, do the following:
(1) Be sure that voltages applied to pins do not exceed the absolute maximum ratings. This should
include attention to abnormal noise, surge levels, etc.
(2) Be sure that abnormal current flows do not occur during the power-on sequence.
Observance of Safety Regulations and Standards
Most countries in the world have established standards and regulations regarding safety, protection from elec-
tromagnetic interference, etc. Customers are requested to observe applicable regulations and standards in the
design of products.
Fail-Safe Design
Any semiconductor devices have inherently a certain rate of failure. You must protect against injury, damage or
loss from such failures by incorporating safety design measures into your facility and equipment such as redun-
dancy, fire protection, and prevention of over-current levels and other abnormal operating conditions.
Precautions Related to Usage of Devices
FUJITSU SEMICONDUCTOR semiconductor devices are intended for use in standard applications (computers,
office automation and other office equipment, industrial, communications, and measurement equipment, per-
sonal or household devices, etc.).
CAUTION: Customers considering the use of our products in special applications where failure or abnormal
operation may directly affect human lives or cause physical injury or property damage, or where extremely high
levels of reliability are demanded (such as aerospace systems, atomic energy controls, sea floor repeaters,
vehicle operating controls, medical devices for life support, etc.) are requested to consult with sales represen-
tatives before such use. The company will not be responsible for damages arising from such use without prior
approval.
2.
Precautions for Package Mounting
Package mounting may be either lead insertion type or surface mount type. In either case, for heat resistance
during soldering, you should only mount under FUJITSU SEMICONDUCTOR’s recommended conditions. For
detailed information about mount conditions, contact your sales representative.
Lead Insertion Type
Mounting of lead insertion type packages onto printed circuit boards may be done by two methods: direct
soldering on the board, or mounting by using a socket.
Direct mounting onto boards normally involves processes for inserting leads into through-holes on the board
and using the flow soldering (wave soldering) method of applying liquid solder. In this case, the soldering process
usually causes leads to be subjected to thermal stress in excess of the absolute ratings for storage temperature.
Mounting processes should conform to FUJITSU SEMICONDUCTOR recommended mounting conditions.
If socket mounting is used, differences in surface treatment of the socket contacts and IC lead surfaces can lead
to contact deterioration after long periods. For this reason it is recommended that the surface treatment of socket
contacts and IC leads be verified before mounting.
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