參數(shù)資料
型號: MB91F647ABGL
元件分類: 微控制器/微處理器
英文描述: 32-BIT, FLASH, 60 MHz, RISC MICROCONTROLLER, PBGA176
封裝: 12 X 12 MM, 1.45 MM HEIGHT, 0.80 MM PITCH, PLASTIC, PFBGA-176
文件頁數(shù): 39/136頁
文件大?。?/td> 4055K
代理商: MB91F647ABGL
MB91645A Series
DS07-16911-1E
133
■ PACKAGE DIMENSION
Please confirm the latest Package dimension by following URL.
http://edevice.fujitsu.com/package/en-search/
(Continued)
176-pin plastic LQFP
Lead pitch
0.50 mm
Package width
×
package length
24.0
× 24.0 mm
Lead shape
Gullwing
Sealing method
Plastic mold
Mounting height
1.70 mm MAX
Code
(Reference)
P-LQFP-0176-2424-0.50
176-pin plastic LQFP
(FPT-176P-M07)
C
2004 FUJITSU LIMITED F176013S-c-1-1
Details of "A" part
0~8
0.50±0.20
(.020±.008)
0.60±0.15
(.024±.006)
0.25(.010)
(Stand off)
(.004±.004)
0.10±0.10
1.50
+0.20
0.10
+.008
.004
.059
(Mounting height)
0.08(.003)
(.006±.002)
0.145±0.055
"A"
INDEX
1
LEAD No.
44
45
88
89
132
133
176
0.50(.020)
0.22±0.05
(.009±.002)
M
0.08(.003)
*24.00±0.10(.945±.004)SQ
26.00±0.20(1.024±.008)SQ
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
2004-2008 FUJITSU MICROELECTRONICS LIMITED F176013S-c-1-2
Note 1) * : Values do not include resin protrusion.
Resin protrusion is +0.25(.010)Max(each side).
Note 2) Pins width and pins thickness include plating thickness
Note 3)Pins width do not include tie bar cutting remainder.
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