參數(shù)資料
型號: MAX9989EVKIT
廠商: Maxim Integrated Products, Inc.
英文描述: Evaluation Kits for the MAX9989/MAX9990
中文描述: MAX9989、MAX9990評估板
文件頁數(shù): 4/8頁
文件大?。?/td> 315K
代理商: MAX9989EVKIT
E
MAX9981 Evaluation Kit
4
_______________________________________________________________________________________
3dB
3dB
LO2
RFMAIN
LO1
+5V
GND
IFMAIN
771.000MHz
RF SIGNAL GENERATOR
(HP 8648B)
770.000MHz
RF SIGNAL GENERATOR
(HP 8648B)
(AMMETER)
291mA
BENCH MULTIMETER
(HP 34401A)
5.0V 500mA (MAX)
POWER SUPPLY
(AG E3631A)
870.000MHz
RF SIGNAL GENERATOR
(HP 8648B)
RF SPECTRUM ANALYZER
(HP 8561x)
RFDIV
IFDIV
RF HIGH-
POWER SENSOR
RF POWER METER
(GIGA 80701A, HP 437B)
50
50
3dB
3dB
LOSEL
OPEN = LO1
GND = LO2
MAX9981
U1
Figure 1. MAX9981 EV Kit Main Mixer Test Setup Diagram
Layout Considerations
The MAX9981 evaluation board can be a guide for your
board layout. Pay close attention to thermal design and
close placement of parts to the IC. The MAX9981 pack-
age exposed paddle (EP), conducts heat from the part
and provides a low-impedance electrical connection.
The EP must be attached to the PC board ground plane
with a low thermal and electrical impedance contact.
Ideally, this can be achieved by soldering the backside
package contact directly to a top metal ground plane on
the PC board. Alternatively, the EP can be connected to
a ground plane using an array of plated vias directly
below the EP.
Depending on the ground plane spacing, large sur-
face-mount pads in the IF path may need to have the
ground plane relieved under them to reduce shunt
capacitance.
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