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參數(shù)資料
| 型號(hào)： | MAX98307EVKIT# |
| 廠商： | Maxim Integrated Products |
| 文件頁(yè)數(shù)： | 9/21頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | KIT EVAL FOR MAX98307 |
| 產(chǎn)品培訓(xùn)模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 放大器類型： | DG 類 |
| 輸出類型： | 1-通道（單聲道） |
| 在某負(fù)載時(shí)最大輸出功率 x 通道數(shù)量： | 3.3W x 1 @ 8 歐姆 |
| 電源電壓： | 2.6 V ~ 5.25 V |
| 板類型： | 完全填充 |
| 已用 IC / 零件： | MAX98307 |
| 已供物品： | 板 |
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Maxim Integrated Products 17
MAX98307/MAX98308
3.3W Mono Class DG Multilevel Audio Amplifier
Ordering Information
Note: All devices operate over the -40°C to +85°C temperature
range.
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
Thermal Considerations
Class DG multilevel amplifiers provide much better effi-
ciency and thermal performance than a comparable Class
AB or Class G amplifiers. However, the system’s thermal
performance must be considered with realistic expecta-
tions and include consideration of many parameters. This
section examines Class DG multilevel amplifiers using
general examples to illustrate good design practices.
MAX98307 (TQFN) Applications Information
The exposed pad is the primary route of keeping heat
away from the IC. With a bottom-side exposed pad, the
PCB and its copper becomes the primary heatsink for
the Class DG multilevel amplifier. Solder the exposed
pad to a large copper polygon. Add as much copper
as possible from this polygon to any adjacent pin on
the amplifier as well as to any adjacent components,
provided these connections are at the same potential.
These copper paths must be as wide as possible. Each
of these paths contributes to the overall thermal capabili-
ties of the system.
The copper polygon to which the exposed pad is
attached should have multiple vias to the opposite side
of the PCB. Make this polygon as large as possible within
the system’s constraints for signal routing.
MAX98308 (WLP) Applications Information
For the latest application details on WLP construction,
dimensions, tape carrier information, PCB techniques,
bump-pad layout, and recommended reflow temperature
profile, as well as the latest information on reliability test-
ing results, refer to Application Note 1891: Wafer-Level
PART
GAIN SET
PIN-PACKAGE
MAX98307ETE+
External
16 TQFN-EP*
MAX98308EWC+
Internal
12 WLP
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MAX98307EVKIT# | 功能描述:音頻 IC 開發(fā)工具 MAX98307 Eval Kit RoHS:否 制造商:Texas Instruments 產(chǎn)品:Evaluation Kits 類型:Audio Amplifiers 工具用于評(píng)估:TAS5614L 工作電源電壓:12 V to 38 V |
| MAX98308EWC+ | 制造商:Maxim Integrated Products 功能描述:- Rail/Tube |
| MAX98308EWC+T | 制造商:Maxim Integrated Products 功能描述:AMPLIFIER - Tape and Reel |
| MAX98309EVKIT# | 功能描述:音頻 IC 開發(fā)工具 MAX98309 Eval Kit RoHS:否 制造商:Texas Instruments 產(chǎn)品:Evaluation Kits 類型:Audio Amplifiers 工具用于評(píng)估:TAS5614L 工作電源電壓:12 V to 38 V |
| MAX98309EWL+ | 制造商:Maxim Integrated Products 功能描述:- Rail/Tube |
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